Bismaleimide resin (BMI Resin or Bismaleimide) is a high-performance thermosetting polymer. Compared to conventional epoxy resins, it offers superior high-temperature resistance, mechanical strength, and electrical insulation properties, making it widely used in aerospace, automotive electronics, advanced composites, and other fields. BMI Resin's molecular structure contains maleimide groups, which form a highly cross-linked network through addition or free radical polymerization. This ensures stable performance in environments with continuous operating temperatures of 250–300°C, maintaining strength and reliability.   Bismaleimide Series BMI-100 CAS:13676-54-5 BMI-200 CAS:67784-74-1 HVA-2 CAS:3006-93-7   Bismaleimide series products manufactured by Yangchen Tech   Product Brand Product Name CAS Number BMI-100(Click here) N,N'-(4,4' DIPHENYLMETHANE)BISMALEIMIDE 13676-54-5 BMI-200(Click here) Phenylmethane maleimide 67784-74-1 BMI-400(Click here) Bisphenol A diphenyl ether bismaleimide 79922-55-7 BMI-500(Click here) 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanebismaleimide 105391-33-1 BMI-600(Click here) BIS(4-MALEIMIDOPHENYL)SULFONE 13102-25-5 BMI-800(Click here) 4-methyl-1,3-phenylenebismaleimide 6422-83-9     Why Choose Bismaleimide Resin?   1.High Thermal Stability: Maintains structural stability even at extremely high temperatures, resisting softening or degradation. 2.Excellent Mechanical Properties: High strength, high rigidity, and wear resistance make it suitable for structural applications. 3.Excellent Electrical Insulation: Low dielectric constant, suitable for high-frequency electronic component applications. Chemical and Flame-Retardant Properties: Corrosion-resistant, flame-retardant, low-smoke, low-toxicity, and compliant with strict safety standards. 4.Strong Processing Adaptability: Compatible with various molding processes, including prepreg, RTM, compression molding, and pultrusion.   Advantages of Yangchen Tech's Bismaleimide Resin Types   Yangchen Tech offers a variety of Bismaleimide resin grades, including BMI-100, BMI-200, BMI-400, BMI-500, BMI-600, BMI-700, and BMI-800. Different grades are customized to meet diverse market demands, including aviation, automotive, electronics, industrial, and defense.   Application Scenarios   1.Aerospace: Manufacture of high-temperature composite structural parts, such as fuselages, wings, and engine thermal insulation components, achieving both lightweighting and heat resistance. Automotive & Rail Transit: Used in engine compartment components, brake friction materials, and lightweight vehicle body composites, improving reliability and lifespan. 2.Electronic & Electronics: Used in PCBs, package substrates, and connectors, ensuring electrical stability under high temperatures. 3.Industrial & Energy: Used in wind turbine blades, drilling tools, and chemical equipment piping, improving wear and corrosion resistance. 4.Special Equipment: Suitable for ship, missile, and radar structural components, ensuring performance and safety in extreme environments.   Why Choose Yangchen Tech?   1.Professional Manufacturer: 20 years of experience in Bismaleimide resin R&D and production. 2.Customized Solutions: Customizable formulations and performance to meet customer needs. 3.International Supply Capabilities: Serving the global market and providing stable delivery. 4.Cost-Effective: Produced in our own factories, ensuring quality and competitive pricing.   Bismaleimide Resin Market    With the development of the aerospace, new energy vehicle, electronics, and defense industries, demand for high-performance Bismaleimide resin continues to grow. BMI Resin has become a preferred choice for composite materials and electronic insulation, and its high-performance products will help global customers enhance their competitiveness. Bismaleimide resin (BMI Resin) is a highly cross-linked thermoset polymer that offers excellent thermal stability, high mechanical strength, superior electrical insulation, and chemical resistance. It is widely used in aerospace, automotive, electronics, energy, and defense applications. Yangchen Tech offers a variety of Bismaleimide resin grades, from BMI-100 to BMI-800, to meet diverse temperature and structural requirements. Contact Yangchen Tech for samples, quotes, or technical support to achieve breakthroughs in high-performance applications.    

  Let's talk about the function of  Rubber Vulcanizing agent HVA-2 (PDM), CAS No. 3006-93-7,in this blog.     HVA-2 manufactured by Yangchen Tech can be used as both a vulcanizing agent and a co-vulcanizing agent in peroxide systems during rubber processing. It can also serve as a scorch retarder and tackifier. It is used in rubber components such as shoulder rubber and breaker layers in load-carrying tires to address shoulder voids in bias-ply truck tires. HVA-2 can also serve as a co-vulcanizing agent, improving related properties and thermal stability. It is suitable for high-temperature vulcanization systems, significantly reducing compression set. It can also reduce peroxide usage, prevent scorching during processing, and improve the bond strength between the rubber and cord and metal.   1. As a multifunctional rubber additive, HVA-2 can be used as both a vulcanizing agent and a co-vulcanizing agent in peroxide systems during rubber processing. It can also serve as a scorch retarder. It is suitable for general-purpose rubber, specialty rubber, and rubber-plastic hybrid systems.   2. In natural rubber, when combined with sulfur, it prevents reversion, improves heat resistance, reduces heat buildup, resists aging, and enhances rubber-cord adhesion and vulcanized rubber modulus. Used in rubber components such as shoulder rubber and cushioning media in load-carrying tires, it can address the shoulder void problem in bias-ply truck tires. It can also be used in large-format, thick-walled natural rubber products and various rubber miscellaneous products.   3. As a co-vulcanizing agent in specialty rubbers such as fluoroprene, fluorosulfonated polyethylene rubber, styrene-butadiene rubber, nitrile rubber, isoprene rubber, butyl rubber, bromobutyl rubber, acrylic rubber, silicone rubber, and rubber-plastic blends, HVA-2 significantly improves related properties and heat resistance. It is suitable for high-temperature vulcanization systems, significantly reduces compression set, reduces peroxide usage, prevents scorching during processing, and enhances the bond strength between the rubber and cord and metal.   4. HVA-2 is a sulfur-free vulcanizing agent. It can replace all slag-containing vulcanizing agents such as those in cable rubber, and solves the problem of copper wire and copper electrical appliances being polluted by sulfur generated by connecting sulfur.   If you have any technical questions about HVA-2 ,pls contact us!         

N,N′-(4,4′-Diphenylmethane)Bismaleimide (BMI) manufactured by Yangchen Tech is a high-performance thermosetting resin used as a matrix in adhesives, composites, and electronic materials. It is valued in aerospace, automotive, electronics and other industries for exceptional thermal and mechanical properties. In its solid form it appears as a light-yellow powder . The molecular structure features two maleimide end-groups linked by a diphenylmethane bridge, which creates a rigid, highly crosslinked network upon curing. This architecture gives BMI resin outstanding thermal stability and strength, making it ideal for high-temperature adhesives and composite matrices. N,N'-(4,4′-Diphenylmethane)Bismaleimide Whatever you needs, Yangchen Tech is at your side. Structure Whatever you needs,Yangchen Tech is at your side. Stock Whatever you needs, Yangchen Tech is at your side.   Molecular structure of N,N′-(4,4′-diphenylmethane)Bismaleimide (BMI) – two maleimide rings (green) bridged by a phenyl-methylene unit. The rigid aromatic structure yields a very high glass transition temperature (Tg) – typically >260°C – and continuous-use stability up to ~200–230°C. By contrast, standard epoxy resins begin to soften above ~150–180°C. In practical terms, BMI-based adhesives and composites maintain structural integrity in severe heat (e.g. under engine hoods or in avionics) where epoxies would degrade. For example, a BMI adhesive film (Final Advanced Materials 307) is rated for long-term use to 240°C. This exceptional heat resistance ensures that bonded joints and composite parts retain stiffness and strength under prolonged high-temperature exposure. Yangchen Tech’s BMI resin – a light yellow powder. This form (light-yellow granular powder) is convenient for formulation into adhesives and polymer matrices. According to Yangchen Tech, BMI resin has a melting point around 155°C and is insoluble in water/ethanol but soluble in solvents like acetone or DMF. These properties facilitate easy handling (dry powder blending) and processing (complete cure at 180–250°C) in industrial formulations.   Outstanding Chemical Resistance   BMI resins are inherently inert to a wide range of chemicals and solvents, making them suitable for harsh environments. The imide rings and aromatic backbone resist hydrolysis and chemical attack. For instance, Yangchen Tech notes the material “has excellent resistance to a variety of chemical solvents and corrosive substances”. In practical tests, a BMI adhesive film (Final Advanced 307) showed “very high” resistance to strong acids (sulfuric, phosphoric, pH=1 at 60°C) and polar solvents (acetone, MEK, NMP). It also bonds well to chemically inert substrates (Al, PTFE, glass). By comparison, many epoxy or polyurethane adhesives can be degraded by strong solvents or acids; BMI-based systems maintain performance where epoxies cannot. This broad chemical stability means BMI adhesives and coatings last longer in aggressive media – e.g. chemical processing equipment or automotive under-hood components – and require less frequent maintenance.   Key features of BMI  resin include:   Solvent Resistance: Excellent stability in ketones, esters and other organics. Final Advanced Materials reports its BMI adhesive is rated “very resistant to various chemicals”. Acid/Alkali Resistance: Effective stability in strong acids (tested at pH 1); alkali resistance is also generally high (though surface prep may be needed). Low Moisture Uptake: BMI absorbs <1% water, preserving insulating and mechanical properties in humid environments (important for electronics and outdoor composites).   These features allow BMI formulations to be used as durable insulation varnishes, chemical-resistant coatings, and structural adhesives in corrosive settings. As one application note states, BMI’s chemical inertness “extends the service life” of equipment in oil & gas, marine or chemical industries.   Any technical requirements,welcome to contact us!        

N-Phenylmaleimide (N-PMI) manufactured by Yangchen Tech is a high-performance specialty monomer widely used in polymer modification, particularly in heat-resistant plastic formulations. With its unique structure and superior thermal properties, N-PMI is becoming a crucial additive in various industries such as automotive, electronics, and advanced materials.     Basic Information   Property Description Chemical Name N-Phenylmaleimide Synonyms NPMI, Monomaleimide CAS Number 941-69-5 Purity ≥99% Appearance Pale yellow crystalline powder Manufacturer Shaanxi Yangchen New Material Technology Co., Ltd   Key Properties of N-Phenylmaleimide   Property Description                                                          Thermal Stability  Decomposition temp. >300°C Glass Transition Temp. (Tg) Significantly increases Tg of ABS and other resins Compatibility Compatible with styrenics (e.g. ABS, SAN), epoxy resins, and engineering plastics Solubility Dissolves in acetone, DMF, THF, etc.     Applications of N-Phenylmaleimide   1. Heat-Resistant Modifier for ABS and Other Plastics   N-PMI significantly improves the heat distortion temperature (HDT) of ABS (Acrylonitrile-Butadiene-Styrene) by increasing rigidity and thermal resistance without sacrificing impact strength. Ideal for automotive interiors, electronics housings, and appliance parts.   2. Monomer for High-Performance Polymers   It acts as a reactive monomer in polymerizations for polyimides, bismaleimides, and copolymers, enhancing thermal, chemical, and oxidative resistance.   3. Crosslinking Agent   Due to its maleimide functionality, NPMI enables crosslinking in styrenic and vinyl polymers, leading to stronger, more heat-stable network structures.   4. Electronics & Semiconductor Materials   Used in resin systems for encapsulants, prepregs, and adhesives where high heat resistance, dimensional stability, and low dielectric loss are critical.   5. Coatings and Adhesives   NPMI enhances adhesion strength and thermal stability in advanced coatings and industrial adhesives.     Why Choose Yangchen Tech’s N-Phenylmaleimide?   As a leading Chinese manufacturer and exporter, Yangchen Tech offers:   High-purity NPMI (≥99%) Flexible packaging and OEM services Global shipping and technical support Customization for research or industrial scale   We focus on quality, consistency, and customer-specific formulations, making our N-PMI ideal for global markets across automotive, aerospace, electronics, and materials science.    👉 Learn more or request a sample at https://www.yangchentech.com     Frequently Asked Questions (FAQ)   Q1: Is N-Phenylmaleimide safe to use? A1: Yes, it is stable under recommended storage conditions. Handle with standard chemical safety procedures.   Q2: What resins are compatible with NPMI? A2: ABS, SAN, PMMA, epoxy, polyimides, and bismaleimide systems.   Q3: How does it improve thermal performance in plastics? A3: It increases the glass transition temperature (Tg) and improves thermal deformation resistance by introducing rigid imide groups.     ➡️ Contact us today for technical datasheets or quotations.      

N,N'-(4,4'-diphenylmethane)bismaleimide is an aromatic bismaleimide resin known for its excellent high temperature resistance and mechanical properties. It is a high melting point yellow powder with strong chemical resistance.In the electronics field, BMI resins manufactured by Yangchen tech is used to make heat-resistant laminates and electrical insulation materials for harsh conditions (H/F grades). In contrast, traditional epoxy resins are widely used in PCB laminates and adhesives due to their low cost and ease of use, but they begin to lose strength and degrade at high temperatures. This blog compares the material properties and application differences of 4,4′-bismaleimide (BMI) and epoxy resins in electronic devices. N,N'-(4,4'-diphenylmethane)bismaleimide Whatever you needs, Yangchen Tech is at your side. Warehouse of Yangchen Tech Whatever you needs, Yangchen Tech is at your side. Warehouse of Yangchen Tech Whatever you needs, Yangchen Tech is at your side.   The rigid, highly conjugated structure of N,N'-(4,4'-diphenylmethane) bismaleimide gives it a high melting point (about 150-160°C) and glass transition temperature. It is almost insoluble in water/ethanol, but soluble in polar organic solvents such as acetone or DMF. High curing temperatures (usually 200-250°C) make BMI crosslinked into a dense three-dimensional network structure with excellent thermal stability.Commercial systems usually mix BMI with vinyl or allyl comonomers (e.g. DABA, vinyl phenol) to improve toughness. Cured BMI is still harder and stronger than most epoxies at high temperatures.   Technical Indicators   Appearance Melting point Acid value Volatile Specification Gel time 200℃ Toluene Solubility Yellow powder 150-160℃ ≤1mgKOH/g ≤1% ＞98% ＜300 S Totally soluble or a small amount of insoluble matter, transparent solution   The significant advantage of 4,4′-bismaleimide (BMI) resins is thermal stability. Unlike standard epoxy resins, which soften and lose modulus above about 120-150°C, BMI-based networks maintain mechanical integrity at temperatures well above 200°C. BMIs maintain strength and stiffness in high temperature environments (e.g., aerospace engines, gas turbines) where epoxies tend to fail. In fact, high-Tg BMI laminates or prepregs maintain excellent mechanical properties up to about 250°C. In contrast, most epoxy-based electronic materials have a Tg below 150°C, limiting them to low-grade insulation applications. BMI also has excellent mechanical strength and stiffness. Its rigid aromatic backbone gives it high tensile and flexural strength. Compared to epoxies, BMI composites can withstand greater static and dynamic loads without deformation. For example, parts made with a 4,4′-BMI matrix, such as aircraft fuselage panels or connector housings, will exhibit higher compression and impact resistance than equivalent epoxy-based parts. In tests, BMI composites have demonstrated improved durability under heavy loads and high-velocity impacts, thereby extending the service life and improving the safety of high-performance equipment. While epoxies are tough at room temperature, they tend to become brittle or creep at elevated temperatures, while the network rigidity of BMI remains strong. Another key advantage is its chemical and environmental resistance. BMI resins are more resistant to corrosion from solvents, acids, and other chemicals than typical epoxy formulations.   Property 4,4′-BMI (Bismaleimide Resin) Epoxy Resin Glass Transition (Tg) >200 °C (often ~250 °C); stable mechanical/dielectric at high temps ~100–150 °C; mechanical properties degrade above ~120 °C High-Temp Strength Retains strength up to ~250 °C Softens and may creep/fail well below 200 °C Mechanical Modulus Stiffer at all temperatures (especially when toughened) Less stiff overall; can be toughened but weakens at high temp Density Lightweight vs. metal; potentially lighter than epoxy formulations Lightweight vs. metal; but slightly denser than BMI in some cases Thermal Conductivity Poor conductor; can be filled for thermal applications Poor conductor; also fillable with ceramics or carbon Electrical Insulation Meets Class F/H (155–180 °C); suitable for motors, coils, high-temp circuits Often limited to Class B (130 °C); may not meet high-temp specs Flame Rating Inherently flame-retardant; low smoke/toxicity, fewer additives needed Needs more additives for flame retardancy            

Phenylmethane bismaleimide BMI-200 (Other name:BMI-2300) ,CAS 67784-74-1) manufactured by Yangchen Tech is a high-performance thermoset resin for demanding aerospace, electronics, adhesives and composite applications. It is an aromatic bismaleimide (BMI) resin known for its excellent thermal stability, mechanical strength and chemical resistance. BMI-200 is typically supplied as a tan crystalline powder and cures to form a hard glassy network with a very high glass transition temperature (typically >250°C) and very low volatile by-products.   Physical Properties Appearance and physical properties: tan crystalline powder (softening point ≈83°C; melting point ≈150-160°C). Density ≈1.22g/cm³. Very low volatile matter content (<1%). Thermal properties: Glass transition temperature ~287°C (DMA); maintains integrity above 250°C. 5% weight loss at around 408°C indicates excellent heat resistance. BMI-2300 cures by addition (Michael/ene reaction) with no volatile byproducts. Mechanical properties: High flexural strength (about 204MPa at room temperature) and stiffness (flexural modulus about 4.4GPa at room temperature). Barcol hardness about 59. High modulus and strength are maintained at elevated temperatures. Electrical properties: Dielectric constant ≈ 3.1, loss tangent ≈ 0.012 (GHz frequency), making it ideal for high-speed/high-frequency electronic devices. High insulation resistance and low dielectric loss. Chemical properties: Acid value about 2.4mgKOH/g. Excellent resistance to solvents, fuels, and moisture. Insoluble in non-polar solvents (e.g. toluene), but soluble in highly polar aprotic solvents (THF, DMF, MEK).   Technical Indicators   Appearance Softening point Acid value Solubility Brownish-yellow lumps 60-120℃ ＜10 50% transparent solution (ketone solvent)   Solubility   Solvent ACETONE MEK THF DMF NMP TOLUENE Phenylmethane bismaleimide 50-80 60-80 20-100 ＜80 ＜50 Insoluble     Benefits of Phenylmethane bismaleimide  BMI-200   Exceptional Thermal Stability: Maintains structural integrity well above 250°C (glass transition ~287°C). Minimizes discoloration and degradation in high-temperature service. Ideal for jet-engine components, turbine parts and high-speed electronic devices. High Mechanical Performance: High modulus and strength even at elevated temperatures. Improves stiffness and fatigue life of composite parts. Resists deformation under load, enhancing reliability of structural laminates and housings. Chemical & Environmental Resistance: Aromatic imide backbone provides excellent resistance to fuels, solvents, acids and moisture. Enables long-term stability in aviation fuels, hydraulic fluids, and corrosive environments. Low moisture uptake improves dimension stability in humid conditions. Electrical & Dielectric Advantages: Low dielectric constant/loss makes BMI-2300 ideal for RF/microwave circuit boards and high-voltage insulation. Ensures signal integrity and insulation strength in harsh environments. High Tg also raises the operating temperature of laminates, improving thermal cycling reliability. Manufacturing Reliability: Cures via addition chemistry without evolving gases, so parts have minimal voiding or blistering. Improves bond adhesion (e.g. to copper foil in PCBs) and composite consolidation. Reduces processing defects compared to condensation thermosets. Lightweight, Flame-Resistant: Enables weight reduction in aerospace/electronics versus metal alternatives while providing inherent flame retardancy (aromatic structures are self-extinguishing). Helps OEMs meet stringent FAR/FMVSS fire, smoke and toxicity requirements.     

Polyimide resin Powder manufactured by Yangchen Tech plays a critical role in advanced friction materials by serving as the high-performance binder or matrix that holds together reinforcing fibers and fillers. Its outstanding thermal stability, wear resistance, and ability to maintain a stable coefficient of friction under changing loads and temperatures make it an ideal replacement for conventional phenolic systems in demanding applications.     High-Temperature Resistance & Thermal StabilityFriction interfaces—such as brake pads and clutch plates—can reach temperatures above 300 °C during heavy or repeated braking. Polyimide resin maintains mechanical integrity and frictional properties at these temperatures, preventing “fade” (loss of braking performance) and extending service life.  Abrasion & Wear ResistanceThe inherently high hardness and chemical resistance of polyimide help reduce material loss under sliding contact. Composites formulated with polyimide binders show lower wear rates compared to phenolic-based friction materials, translating to longer intervals between replacements.  Stable Coefficient of FrictionPolyimide-based composites exhibit minimal variation in friction coefficient across a wide temperature range, ensuring predictable braking or clutch engagement without judder, chatter, or noise. Modifications—such as adding graphite or ceramic fillers—can further tune friction levels for specific applications.  Applications Automotive & Heavy-Duty Brakes: Pads and linings for performance vehicles, trucks, and off-road equipment that demand high fade resistance. Aerospace Brake Systems: Carbon-carbon or carbon-ceramic discs often use polyimide matrix composites for landing-gear and wheel brakes, where weight savings and thermal endurance are paramount. Industrial Machinery: Clutches and brakes in stamping presses, mining equipment, and wind-power generators benefit from the resin’s durability under high loads. Grinding Wheels & Cutting Tools: As a binder for superabrasive (diamond, CBN) wheels, polyimide delivers improved wheel life and cutting consistency at elevated operating temperatures. Processing & FabricationTypical manufacturing methods include hot molding, cold/hot isostatic pressing, and even advanced techniques like injection molding or 3D printing of pre-ceramic precursors. These processes allow precise control of resin/filler ratios and part geometry.    When you need friction materials that can withstand extreme heat, deliver consistent braking performance, and offer superior wear life, polyimide resin — often filled with fibers (e.g., aramid, carbon) and solid lubricants (e.g., graphite, MoS₂) — is the binder of choice for next-generation brake pads, clutch facings, industrial brakes, and superabrasive tools.

Improving ABS Heat Resistance: YangchenTech’s Styrene-NPMI-MAH Copolymer   Acrylonitrile-butadiene-styrene (ABS) is a widely used plastic prized for its strength, toughness, and ease of processing. However, its heat resistance is inherently limited.This blog will explain why ABS has these limitations and explore ways to improve its thermal performance—with a focus on chemical modifiers. Next, we’ll explore how YangchenTech’s styrene-NPMI-MAH copolymer, a powerful ABS heat modifier, can significantly improve ABS’s thermal stability.   Styrene-NPMI-MAH Copolymer Manufactured by YANGCHEN TECH  Weicome Inquiry!   Basic Information   Test Item Test Standards Test Data Molecular weight and distribution GPC Mw=12~16*104.PDI=2.0~3.0 Glass transition temperature/℃ DSC 160~210℃(Adjustable) Initial decomposition temperature/℃ TGA 395-405℃ Density  ASTM-D792 1.00~1.15g/cm3 Appearance NG Off-white powder     1.Why is standard ABS heat resistant?   ABS’s modest heat resistance limit stems from its molecular structure. As an amorphous material, it has no clear melting point—above the glass transition temperature (about 100°C), it softens. Even under moderate loads, unreinforced ABS deforms by about 1% at about 88-98°C. This is consistent with industry data: standard ABS can only be used continuously at temperatures around 80°C. In fact, once ABS approaches 100°C, it “becomes very soft and cannot hold its shape under pressure.” Its rubbery butadiene phase (Tg about -90°C) has good impact toughness, but no heat resistance. In short, ABS’s styrene-acrylonitrile matrix is ​​not rigid enough at high temperatures to maintain mechanical properties. As one review notes, ABS’s thermal stability is “quite low,” which limits its use in high-temperature environments, such as unreinforced automotive interiors.   2. Strategies to improve ABS’s thermal performance   To overcome these limitations, engineers have used several strategies:   High-temperature alloys (polymer blends): Blending ABS with engineering plastics with higher Tgs can improve overall heat resistance. For example, ABS/PC alloys (ABS combined with polycarbonate) can be made into materials with higher HDTs than ABS alone. Such blends generally improve tensile strength and stiffness, as well as thermal stability. For this reason, ABS-PC filaments are popular in the 3D printing community. Reinforced composites: Adding inorganic fillers can significantly increase ABS’s HDT. Glass fibers are particularly effective—about 30% glass fiber filler can increase ABS’s heat distortion temperature (HDT) by about 40°C (e.g., from about 90°C to about 130°C) by forming a thermally stable network. Talc or mica fillers can slightly increase the heat distortion temperature (about 10-15°C) by forming a heat-insulating layer. These reinforcements also increase stiffness, but may reduce impact strength. Heat stabilizers: Additives such as hindered phenol antioxidants or organometallic stabilizers can slow down the thermal oxidation of ABS, extending its service life at high temperatures. Flame retardant additives (bromine-based or phosphorus-based) not only reduce flammability but also enhance thermal stability, thereby increasing the distortion temperature of ABS. Annealing and processing: Careful processing (such as annealing molded parts) can relieve internal stresses and improve heat distortion performance. Optimizing mold design and curing conditions can also help parts withstand higher service temperatures. Chemical modification: Arguably the most effective method is to modify the ABS polymer itself, either by copolymerization or grafting. Introducing rigid monomers into the ABS backbone can significantly increase its Tg and heat distortion performance. This led us to develop Styrene-NPMI-MAH terpolymers, a class of heat-resistant ABS modifiers developed and produced by Yangchen Tech.   3. Styrene-NPMI-MAH copolymer: a high-performance ABS modifier   Styrene-NPMI-MAH copolymer (also known as NSM copolymer) is a random terpolymer of styrene, N-phenylmaleimide (NPMI), and maleic anhydride (MAH). Its high heat resistance comes from its aromatic rigid NPMI units and polar MAH groups. YangchenTech's copolymers can be formulated to have glass transition temperatures well above 150°C.     N-Phenylmaleimide Manufactured by YANGCHEN TECH Weicome Inquiry! Specification     Property Limits Results Appearance Yellow powder Yellow powder Purity % >98 99.5 Melting Range ℃ >85 88~90   NPMI-styrene-MAH copolymer (about 47% NPMI content in the composition) has a glass transition temperature (Tg) of about 190°C. When mixed with ABS, the effect is significant: Vicat softening point, tensile strength, and flexural strength all increase with increasing addition of NSM copolymer.   Any technical support,pls contact us!      

N-Phenylmaleimide (abbreviated N-PMI), also known as monomaleimide,(C₁₀H₇NO₂, CAS 941-69-5) manufactured by Yangchen Tech used as a high-performance polymer synthetic monomer and modifier.  Structurally, N-PMI features a maleimide ring bonded to a phenyl group, making it highly reactive in both free-radical and ionic polymerizations.  It is produced as a pale yellow crystalline powder (melting point \~88–90 °C) and is valued for its ability to impart heat resistance, mechanical strength, and unique functional properties to resins and plastics.  N-PMI also exhibits photosensitivity and biocidal (disinfectant) activity, which has led to its use as a bactericide, fungicide, and antifouling agent in coatings.     Chemical and Functional Properties   Heat Resistance: N-Phenylmaleimide greatly improves thermal stability when copolymerized with vinyl monomers.  Even small additions (≈1–5% by weight) to ABS, PVC or PMMA resins can raise the heat distortion temperature (HDT) by \~2 °C per wt% of N-PMI.  For example, incorporating 10% N-PMI into ABS can elevate its heat-resistance to about 125–130 °C.  In comparative studies, N-PMI–modified ABS achieved HDT near 150 °C, whereas typical α-methylstyrene modifiers cap around 115 °C.  This high thermal stability makes N-PMI a preferred heat-resistant ABS modifier and engineering polymer additive. Mechanical Properties: N-Phenylmaleimide enhances the mechanical strength and stiffness of polymers.  Copolymers containing N-PMI show higher tensile strength, hardness, and impact resistance than unmodified plastics.  It also improves melt-flow and processability, enabling easier molding and extrusion without degradation.   Specification     Appearance Melting point  Purity Solubility Yellow crystalline powder or flakes 85-90℃ ＞99% Soluble in organic solvents   Chemical and Flame Resistance:  When added to resins, N-PMI increases chemical resistance against acids, bases and solvents.  It also has inherent flame-retardant character; incorporating N-PMI into a polymer matrix can improve the material’s fire resistance, a critical property for electronics and construction applications. Photosensitivity and Biocidal Activity:  N-Phenylmaleimide is used in photosensitive resins and coating formulations due to its ability to undergo UV-initiated polymerization.  Uniquely, it possesses disinfectant properties – it is listed as a *bactericide, fungicide and underwater organism repellent*.  This makes it useful as an antifouling additive in marine coatings and as an intermediate in agricultural chemicals (e.g. plant-growth regulators and pesticides).   Solubility   N-Phenylmaleimide is highly soluble in many organic solvents (e.g. acetone, DMF, benzene), facilitating its use in reactive extrusion and solution polymerizations.  In summary, its combination of heat resistance, mechanical reinforcement, flame-retardancy and biocidal effects make N-phenylmaleimide a versatile monomer and modifier in advanced polymer systems.     Chemical Structure Chemical Formula C10H7NO2 Molecular Weight 173.16 CAS No. 941-69-5 Packing Type Paper bag (20 kg)   Applications in Polymers and Alloys   N-Phenylmaleimide manufactured by Yangchen Tech is primarily used as a comonomer modifier to produce heat-resistant plastic alloys and copolymers.  Heat-Resistant ABS (Acrylonitrile-Butadiene-Styrene):  N-PMI is widely added to ABS resin to create *N-PMI–modified ABS*, often called heat-resistant ABS.  The maleimide group copolymerizes with styrenic monomers, greatly improving HDT and thermal stability.  Even 1% N-PMI raises ABS HDT by \~2 °C.  N-PMI–ABS finds use in automotive parts (dashboards, engine covers), electronics housings and any application requiring high-temperature performance. PVC and PVC/ABS Blends:  Blending N-PMI into PVC or PVC/ABS alloys increases softening temperature and heat deflection.  For example, N-PMI improves the heat resistance of PVC-ABS compounds used in television and office equipment housings. PMMA (Acrylic Resins):  In polymethyl methacrylate (PMMA) and other acrylic resins, N-PMI copolymerization boosts thermal endurance.  N-PMI-modified PMMA is suitable for optical components (discs, lenses) and lighting parts that must withstand higher service temperatures. Engineering Plastic Alloys:  N-PMI is incorporated into blends of engineering plastics such as polyamide (PA), polycarbonate (PC), and PBT.  These polymer alloys – used in automotive and appliance components – gain improved thermal stability from N-PMI modification. Please consult us for more information about N-Phenylmaleimide polymer applications.Welcome Inquiry!  

The growing demand for high-performance printed circuit boards (PCBs) has led formulators to seek advanced resin systems that deliver superior thermal, mechanical, and dielectric properties. Phenylmethane maleimide, traded as BMI-200 (CAS 67784-74-1) and also available from Yangchen Tech as BMI-2300 to some Japanese companies, is a modified bismaleimide resin that directly addresses these needs. By adding BMI-200 to copper clad laminates (CCLs), formulators can achieve higher glass transition temperatures (Tg), lower dielectric losses, enhanced dimensional stability, and better copper adhesion, ultimately extending the life and reliability of PCBs in demanding applications such as telecommunications, automotive electronics, and aerospace systems.   1. Overview of Phenylmethane Maleimide (BMI-200) 1.1 Chemical Properties and Structure Chemical Name: Phenylmethane Maleimide CAS: 67784-74-1 Appearance:     1.2 Key Performance Characteristics Thermal Stability: BMI-200 maintains integrity at temperatures above 250°C, minimizing discoloration and degradation of the resin during PCB multilayer lamination High Glass Transition Temperature (Tg): Addition of BMI-200 significantly increases the Tg of the laminated material, ensuring dimensional stability under thermal cycling conditions. Mechanical Strength: BMI-200 provides high modulus and stiffness, reducing CTE mismatch between copper and resin, thereby mitigating warpage and delamination. Chemical Resistance: BMI-200 has excellent resistance to solvents, acids, and moisture, ensuring signal integrity in harsh environments.   Technical Indicators Appearance Softening point Acid value Solubility Brownish-yellow lumps 83℃ 2.42 Clear and transparent   Solubility Solvent ACETONE MEK THF DMF NMP TOLUENE BMI-2300(ref) 50-80 60-80 20-100 ＜80 ＜50 Insoluble   2. Impact on CCL Performance 2.1 Increased Glass Transition Temperature (Tg) A higher Tg of a CCL means that the CCL maintains good mechanical strength at elevated temperatures. If formulated correctly, BMI-200 oligomers can increase Tg to over 210°C, surpassing many standard epoxies.   2.2 Enhanced Dielectric Performance Low dissipation factor (Df) and stable dielectric constant (Dk) are critical for high-speed signal transmission. BMI-200-based laminates have low Df aging rates and controlled dielectric constant temperature coefficients, ensuring minimal signal distortion in the RF and microwave domains.   2.3 Dimensional and Mechanical Stability The high crosslink density imparted by the maleimide groups results in low thermal expansion (Z-axis CTE <1.3%), minimizing interlaminar stress and copper delamination degradation during thermal cycling. Higher copper foil adhesion (>1 N/mm) also improves reliability under mechanical vibration and thermal shock.   2.4 Long-term reliability BMI-200's inherent chemical stability and mechanical integrity extend the life of PCBs. Laminates containing BMI-200 exhibit minimal dendritic delamination patterns and stable interconnect stress test results during long-term aging.   3. Applications in Advanced PCB Technologies High-frequency RF and microwave PCBs: Ideal for telecommunications, satellite communications, and 5G infrastructure due to low dielectric loss and stable dielectric constant (Dk). Automotive electronics: Withstands high temperatures in the engine compartment and supports lead-free soldering processes without resin degradation. Aerospace and defense: High Tg and radiation resistance make BMI-200 laminates suitable for avionics and radar systems.   4. Why choose Yangchen Technology's BMI-200 powder? Yangchen Technology Factory is a leading manufacturer of high-performance resin materials in China. The production process of its BMI-200 phenylmethane maleimide powder follows strict quality control to ensure: Guaranteed purity (≥98%): Minimizes unwanted side reactions and ensures consistent laminate performance Customized particle size distribution: Optimizes dispersion in the resin matrix for uniform cure and mechanical strength Customizable batch production: Supports different oligomerization levels and functionalization levels to meet specific copper clad laminate (CCL) requirements Full technical support: Expert guidance on formulation, process parameters and performance testing   For more information or to request a quote, please Inquiry us!