Diphenylmethane bismaleimide (DMBMI) is a bismaleimide resin that can be used as a cross-linking agent or curing agent in the production of insulation materials. DMBMI provides enhanced thermal and mechanical properties, making it suitable for applications where high-temperature resistance and excellent electrical insulation are required. Here’s a general guide on how DMBMI can be used in insulation material manufacturing: 1.Material Preparation: Obtain the necessary base insulation material, such as fiberglass, aramid paper, or mica sheets. Clean and prepare the surface of the insulation material to ensure proper adhesion of the DMBMI resin. 2.Mixing: Wear appropriate personal protective equipment, including gloves, goggles, and a respirator, as DMBMI can be hazardous. Measure the appropriate amount of DMBMI resin and mix it with a suitable epoxy resin or thermosetting resin, depending on the specific requirements of the insulation material. Add any necessary additives or fillers as per the specific formulation requirements. 3.Impregnation or Coating: Apply the DMBMI resin mixture onto the surface of the insulation material using suitable coating techniques such as roll coating, dip coating, or spray coating. Ensure that the resin mixture is evenly distributed and thoroughly impregnates the insulation material. 4.Curing: Place the impregnated insulation material in an oven or heating chamber. Follow the recommended temperature and curing time provided by the resin manufacturer for curing the DMBMI resin. The curing process typically involves ramping up the temperature gradually to the desired level and maintaining it for a specified duration. This allows the DMBMI resin to cross-link and cure, resulting in a strong and thermally stable insulation material. 5.Post-Curing and Finishing: Once the curing process is complete, remove the insulation material from the oven and allow it to cool to room temperature. Trim, clean, and inspect the insulation material to ensure it meets the desired specifications. Further processing steps, such as cutting, shaping, or laminating, can be performed to create the final insulation product. It’s important to note that the specific process parameters and formulations may vary depending on the type of insulation material, the application requirements, and the manufacturer’s recommendations. It is recommended to consult technical data sheets and guidelines provided by the resin manufacturer for detailed instructions and optimal usage conditions when using DMBMI in insulation material production. Additionally, safety precautions and handling guidelines for working with hazardous materials should always be followed.

Diphenylmethane bismaleimide (DMBMI) is a type of bismaleimide resin that is commonly used as a curing agent or cross-linking agent in the production of Copper-Clad Laminates (CCL). CCL is a key component in the manufacturing of printed circuit boards (PCBs). DMBMI can be used in CCL production to provide enhanced thermal and mechanical properties. Here’s a general guide on how DMBMI can be used in CCL manufacturing: 1.Preparing the CCL: Obtain the necessary materials, including a suitable reinforcing substrate (typically glass fiber fabric) and a copper foil. Clean the copper foil surface to remove any contaminants that may affect adhesion. Pre-treat the reinforcing substrate according to the manufacturer’s instructions to ensure good bonding between the resin and the substrate. 2.Mixing: Wear appropriate personal protective equipment, including gloves, goggles, and a respirator, as DMBMI can be hazardous. Measure the appropriate amount of DMBMI resin and mix it with a compatible epoxy resin, such as a bisphenol-A-based epoxy. Add any necessary additives or fillers as per the specific requirements of the CCL formulation. 3.Impregnation: Apply the resin mixture onto the glass fiber fabric using suitable coating techniques such as roll coating, dip coating, or spray coating. Ensure that the resin is evenly distributed and impregnates the fabric uniformly. 4.Lamination: Place the impregnated glass fiber fabric between layers of copper foil to form a stack. Apply heat and pressure to the stack using a hot press or lamination press to facilitate the curing process. Follow the recommended temperature and pressure profiles provided by the resin manufacturer for curing the DMBMI resin. 5.Curing: Apply a controlled amount of heat and pressure to the stack, following the curing schedule provided by the resin manufacturer. The curing process typically involves ramping up the temperature to a specific level and maintaining it for a specified duration. This allows the DMBMI resin to cross-link and cure, resulting in a strong and stable CCL. 6.Post-curing and Finishing: Once the curing process is complete, allow the CCL to cool down to room temperature. Trim, clean, and inspect the CCL to ensure it meets the desired specifications. Further processing steps, such as drilling, etching, and plating, can be performed to create the final PCB product. It’s important to note that the specific process parameters and formulations may vary depending on the specific CCL requirements and the manufacturer’s recommendations. It is recommended to consult technical data sheets and guidelines provided by the resin manufacturer for detailed instructions and optimal usage conditions when using DMBMI in CCL production.

Application The polyimide films market has been segmented into FPC, specialty fabricated product, pressure sensitive tape, motor / generator and wire & cable. As per the findings of research, FPC held the largest share of the market in terms of both revenue and volume in 2016. Polyimide films are most preferred over other materials such as polycarbonates, epoxy resins, and polyurethanes, for manufacturing FPC owing to its blend of electrical, chemical, mechanical, and thermal properties. Asia-Pacific held the largest share of the polyimide films market in terms of both revenue and volume in 2016. In Asia-Pacific, PI films are mostly consumed in semiconductor foundries and semiconductor component manufacturing facilities located in Taiwan, China and Japan. In addition, growing usage of PI films based electronics devices among users has created surge in demand for the polyimide films market. How to make the polyimide film? Preparation of monomers. The first step is to prepare the monomers, which are the building blocks of polyimide resin. The most common monomers used to make polyimide resin are diamines and dianhydrides. Diamines are compounds with two amino groups, while dianhydrides are compounds with two carboxylic acid groups. Polycondensation reaction. The monomers are then reacted together in a polycondensation reaction to form poly(amic acid). This reaction is typically carried out in a solvent, such as dimethylformamide (DMF) or N,N-dimethylacetamide (DMAc). Imidization. The poly(amic acid) is then imidized to form polyimide. This is done by heating the poly(amic acid) to a high temperature, typically in the range of 200-300 degrees Celsius. The imidization reaction is exothermic, so the temperature of the reaction must be controlled carefully. Film formation. The polyimide can then be cast into a film. This is typically done by dissolving the polyimide in a solvent and then casting the solution onto a substrate. The solvent is then evaporated, leaving behind the polyimide film. The following are some additional details about the process: The choice of monomers will affect the properties of the resulting polyimide film. For example, the type of diamine used will affect the film’s thermal stability, while the type of dianhydride used will affect the film’s mechanical properties. The polycondensation reaction can be carried out in either a solution or a melt phase. The solution phase is more common, as it is easier to control the reaction conditions. The imidization reaction can be carried out in either a batch or a continuous process. The batch process is more common, but the continuous process is more efficient. The film formation process can be carried out using a variety of methods, including casting, spin coating, and extrusion. The casting method is the most common, as it is relatively simple and inexpensive. So far, the thermal decomposition temperature of our PI is 450°C, the long-term use temperature can reach more than 200°C, and the short-term use above 300°C is acceptable.

Absolutely! Polyimide resin is widely used in the production of polyimide PCBs (Printed Circuit Boards). Polyimide PCBs offer numerous advantages, making them a popular choice in various industries, especially those requiring high-performance and reliable electronic components. Polyimide resin’s unique properties make it an excellent material for PCBs. Here’s why: 1️⃣ Thermal Stability: Polyimide resin has exceptional heat resistance, allowing PCBs to withstand high temperatures during operation without compromising performance. This makes them suitable for applications in aerospace, automotive, and industrial environments. 2️⃣ Electrical Insulation: Polyimide resin provides excellent electrical insulation properties, ensuring reliable isolation between conductive traces and preventing electrical leakage or short circuits. It is crucial for sensitive electronic components and high-frequency applications. 3️⃣ Mechanical Strength: Polyimide resin imparts mechanical strength to PCBs, making them highly resistant to bending, flexing, and vibrations. This durability is essential for PCBs used in harsh environments or applications where the board may undergo mechanical stress. 4️⃣ Chemical Resistance: Polyimide resin exhibits robust chemical resistance, protecting PCBs from damage caused by exposure to various chemicals, including solvents, acids, and bases. This characteristic is particularly valuable in industrial or chemical processing applications. 5️⃣ Lightweight and Compact: Polyimide PCBs are lightweight and thin, allowing for space-efficient designs and reducing the overall weight of electronic devices. This feature is advantageous in applications where size and weight are critical factors, such as aerospace or portable electronics. By leveraging the exceptional properties of polyimide resin, PCB manufacturers can create highly reliable and durable circuit boards suitable for demanding applications. The use of polyimide PCBs has been instrumental in advancing technology and enabling innovations across industries. If you’re interested in incorporating polyimide PCBs into your projects or want to explore more about their capabilities, don’t hesitate to reach out or visit our website. Let’s unlock the potential of polyimide resin together and revolutionize the world of electronics!

Polyimides (PIs) are high-temperature engineering polymers originally developed by the DuPont™ Company. PIs exhibit an exceptional combination of thermal stability (>500°C), mechanical toughness, and chemical resistance. They have excellent dielectric properties and inherently low coefficient of thermal expansion. They are formed from diamines or diisocyanates and dianhydrides such as those shown in the picture.         There is more than one type of polyimide. Today we are going to talk about the polyimide resin and polyimide film. The chart below just shows the comparisons.       Polyimide film could be made from polyimide resin. The resin is first dissolved in a solvent and then cast onto a substrate. The solvent is then evaporated, leaving behind a thin film of polyimide. The film is then annealed, which helps to improve its properties.   The connection between polyimide film and polyimide resin is that they are both made from the same basic materials. The difference is that the film is a thin, flexible sheet, while the resin is a more viscous liquid.   Polyimide film and polyimide resin have many of the same properties. They are both heat-resistant, strong, and chemically resistant. They are also both transparent to a wide range of wavelengths.   However, there are some differences between the two materials. Polyimide film is more flexible than polyimide resin. This is because the film is made from a thinner layer of material. Polyimide resin is also more viscous than polyimide film. This means that it is more difficult to work with.   Polyimide film and polyimide resin are both valuable materials with a wide range of applications. They are used in a variety of industries, including electronics, aerospace, and medical devices.   Reference: https://www.sciencedirect.com/topics/materials-science/polyimide

Polyamide resin and polyimide resin are both types of synthetic polymers with distinct characteristics. Here are the key differences between them: Chemical Structure: Polyamide resin: Polyamides have repeating amide (-CONH-) linkages in their molecular structure. They are also known as nylon resins. Polyimide resin: Polyimides have repeating imide (-CO-N-Ph-N-CO-) linkages in their molecular structure. Thermal Stability: Polyamide resin: Polyamides have moderate to good thermal stability, with melting points typically below 300°C. Polyimide resin: Polyimides have excellent thermal stability and can withstand high temperatures, often exceeding 300°C without significant degradation. They are known for their exceptional heat resistance. Mechanical Properties: Polyamide resin: Polyamides offer good mechanical properties, including high strength, toughness, and abrasion resistance. They have relatively good impact resistance. Polyimide resin: Polyimides exhibit excellent mechanical properties, such as high strength, stiffness, and dimensional stability. They are known for their exceptional tensile strength and modulus. Chemical Resistance: Polyamide resin: Polyamides have good resistance to many chemicals, oils, and solvents. However, they may be affected by strong acids and bases. Polyimide resin: Polyimides have excellent resistance to chemicals, acids, bases, solvents, and most organic compounds. They are highly resistant to degradation from aggressive substances. Applications: Polyamide resin: Polyamides are commonly used in various applications, including textiles, engineering plastics, automotive parts, electrical connectors, and consumer goods. Polyimide resin: Polyimides are widely used in demanding applications that require high-temperature resistance, such as aerospace components, electrical insulation, semiconductors, and high-performance coatings. It’s worth noting that there are different types of polyamides and polyimides, each with its own variations and specific properties. The differences mentioned above provide a general overview of the contrasting characteristics between these resin types. So, do you think both of them could be used in the polyimide film? If you have any questions,pls feel free to contact: business@xysjgm.com        

Polyimide (PI) resin manufactured by Yangchen Tech is a high-performance synthetic resin that is known for its excellent thermal stability, mechanical properties, chemical resistance, and electrical properties. It is a thermosetting polymer, which means that it cures into a permanent shape when heated.   PI resin is made by reacting an aromatic diamine with an aromatic dianhydride. The resulting polymer has a high molecular weight and a high degree of cross-linking. This gives PI resin excellent thermal and mechanical properties.   PI resin is used in a wide range of applications, including: Electronics: PI resin is used in the manufacture of printed circuit boards, high-temperature insulation, and connectors. Aerospace: PI resin is used in the manufacture of aircraft parts, missiles, and satellites. Chemical processing: PI resin is used in the manufacture of chemical processing equipment, such as pumps, valves, and reactors. Medical devices: PI resin is used in the manufacture of medical implants, such as heart valves and artificial joints. PI resin is a versatile material with a wide range of applications. Its excellent thermal and mechanical properties make it ideal for use in harsh environments. Advantages of Polyimide Resin Excellent thermal stability: PI resin can withstand temperatures up to 500°C (932°F) without significant degradation. Good mechanical properties: PI resin is strong, tough, and resistant to impact. Excellent chemical resistance: PI resin is resistant to a wide range of chemicals, including acids, bases, and solvents. Good electrical properties: PI resin is a good insulator and has high dielectric strength. Disadvantages of Polyimide Resin High cost: PI resin is more expensive than other types of resin. Difficult to process: PI resin can be difficult to process due to its high viscosity. Limited availability: PI resin is not as widely available as other types of resin. Conclusion Polyimide resin produced by Yangchen Tech is a high-performance material with a wide range of applications. Its excellent thermal and mechanical properties make it ideal for use in harsh environments. However, PI resin is also more expensive and difficult to process than other types of resins. If you are looking for a high-performance material that can withstand extreme conditions, then polyimide resin is a good option. However, if you are looking for a more cost-effective and easy-to-process material, then you may want to consider other types of resins.   If you have any questions,pls feel free to contact: business@xysjgm.com  

As a firm specializing in the manufacturing of N-PMI, Yangchen Tech has strong strength in N-PMI production capacity, R&D strength, and pre-sales and after-sales services. Our products have passed a number of Reach certifications, as well as IS09001-2015 international quality system, and environmental and occupational certifications.   Yangchen Tech has advanced production equipment and an efficient production process. Our production team is experienced and has a strict quality control system to ensure the high quality and stability of products. At the same time, we also pay attention to product innovation and optimization and continuously improve production efficiency and product performance to meet the changing needs of customers. As a powerful supplier of N-PMI, our customer base is all over the world.   Phenylmaleimide (N-PMI) produced by Yangchen has a variety of applications due to its unique properties and compatibility with other polymers, mainly in: (1) Heat stabilizer: N-PMI is usually used as a heat stabilizer in various polymers and plastics. It improves the heat resistance of these materials, enabling them to withstand high temperatures without degradation. This makes it useful in applications that require thermal stability, such as electronic components, automotive parts, and electrical insulation. (2) Flame retardant: N-PMI has flame retardant properties and can be used as an additive to polymers to enhance its fire resistance. It helps reduce the material’s flammability and prevents the spread of flames, making it suitable for applications in building materials, textiles and electronics. (3) Cross-linking agent: N-PMI can act as a cross-linking agent during the polymerization process. When combined with other monomers, it forms a cross-linked network that increases the strength, rigidity, and dimensional stability of the resulting polymer. This property makes it valuable in adhesive formulations and coatings. (4) Polymer modification: N-PMI can also be used as a modifier to improve the performance of other polymers. When added to various polymer systems, it enhances heat resistance, impact strength, and chemical resistance. This makes it useful for modifying the properties of plastics, elastomers, and coatings. If you have any questions,pls feel free to contact: business@xysjgm.com      

N-PMI (N-Phenylmaleimide) is a high-performance chemical intermediate that can be used for a variety of applications and is a must-have product for many industries. Finding a reliable N-PMI supplier is a challenging task as the market is vast and there are many factors to consider. The following three points will help you: 1. How to choose an N-PMI Manufacturer When looking for a reliable N-PMI supplier, it is critical to ensure that the supplier you choose is an N-PMI manufacturer. Manufacturers produce N-PMI from the ground up, ensuring product quality, consistency, and reliability. Working directly with a manufacturer offers several advantages, including better lines of communication, faster delivery, and lower prices. 2. Evaluate Supplier Production Capabilities To ensure a sustainable supply of N-PMI, you need to select a supplier with good manufacturing capabilities. It is important to check whether the supplier has advanced equipment and technology. You should also find out their production scale to ensure that they are capable of meeting your volume requirements. A supplier with excellent production capacity can provide high-quality N-PMI products in a timely and consistent manner. 3. Checking Certifications Verifying certification is an essential step in finding a reliable N-PMI supplier. Certification is proof that a supplier adheres to international standards. In particular, you should look for the Reach certification, which ensures that a product complies with European Union regulations regarding the registration, evaluation, authorization, and restriction of chemicals. In addition, you should verify that the supplier has obtained the IS09001-2015 international quality system certification as well as environmental and occupational certifications. These certifications ensure that the supplier complies with environmental and quality standards. In addition to these three points, it is important to check the supplier’s communication skills, delivery capabilities, and after-sales service. A reliable supplier should be responsive, flexible, and committed to providing excellent customer service. Yangchen Tech owns a variety of maleimide series products with independent intellectual property rights, such as m-phenylene bismaleimide (HA-8/HVA-2), diphenylmethane bismaleimide (BMI), phenylmaleimide (N-PMI), MS-NB, polyimide resin (PI), and diallyl bisphenol A. We also produce various kinds of rubber auxiliaries, such as reactive non-extraction antioxidant MC, environmentally friendly compound rubber antioxidant PTNP, and vulcanizing agent TCY. We also produce all kinds of rubber additives, such as reactive non-extractable antioxidant MC, environmentally friendly composite rubber antioxidant PTNP, vulcanizing agent TCY, etc.   If you have any questions,pls feel free to contact: business@xysjgm.com      

The application of N,N’-4,4’-diphenylmethane bismaleimide manufactured by Yangchen Tech in making electronic chips mainly benefits from its excellent high temperature performance and chemical stability. High temperature stability: BMI has excellent heat resistance and can still maintain stable physical and chemical properties under high temperature conditions. This makes BMI an ideal material for making electronic chips, as high-temperature processing may be required during electronic chip manufacturing, and BMI can show good stability under such conditions. Low dielectric constant and dielectric loss: BMI has a low dielectric constant and dielectric loss, which means that it can be used as an insulating material in electronic chips, helping to reduce energy loss and interference during signal transmission. Mechanical strength: BMI resin has high mechanical strength after curing, which can provide good structural support and protection, helping to protect the tiny devices inside the electronic chip from the external environment.     With the above excellent properties, BMI can be well used in the manufacturing of electronic chips. Can be applied in the following aspects：   1. Packaging materials: BMI can be used as packaging materials to protect and encapsulate tiny devices inside electronic chips. BMI resin has excellent heat resistance and chemical stability, can remain stable in high temperature environments, and provides good mechanical strength and protective properties. 2. Backplane material: BMI can be used as a backplane material for electronic chips to provide mechanical support and thermal management for the chip. BMI has good mechanical strength and thermal conductivity, which can effectively disperse and conduct the heat generated by the chip, thereby maintaining the stable operation of the chip.     3. Composite materials: BMI can be combined with other materials to form composite materials, which are used to make substrates or carriers for electronic chips. By adjusting the composition and structure of composite materials, the performance of electronic chips can be optimized, such as improving thermal conductivity and reducing dielectric constant. 4. Insulating materials: BMI has a low dielectric constant and dielectric loss and can be used as an insulating material in electronic chips to help reduce energy loss and interference during signal transmission.   If you have any questions,pls feel free to contact: business@xysjgm.com  

N-Phenylmaleimide (N-PMI) manufactured by Yangchen Tech can indeed be used as a heat-resistant modifier in ABS (Acrylonitrile Butadiene Styrene), PVC (Polyvinyl Chloride), PMMA (Polymethyl Methacrylate) resins, and photographic materials.   When N-PMI is added to these resins, it can improve their heat resistance, impact resistance, hot-melt properties, and processability. The addition of N-PMI helps to enhance the overall performance of the resin and make it more suitable for applications requiring high temperature resistance and durability.   By acting as a heat-resistant modifier, N-PMI can increase the stability of the resin at elevated temperatures, allowing it to retain its mechanical properties and structural integrity. This makes it particularly useful in industries such as automotive, electronics, and construction where heat resistance is important.   Furthermore, N-PMI can also improve the impact resistance of the resin, making it less prone to cracking or breaking under stress or impact. This property is crucial in applications where the material may be subjected to mechanical forces or impacts.   Additionally, N-PMI enhances the hot-melt properties of the resin, enabling it to be easily processed and shaped during manufacturing processes such as injection molding or extrusion.   Overall, the addition of N-Phenylmaleimide to ABS, PVC, PMMA resins, and photographic materials offers several benefits, including improved heat resistance, impact resistance, hot-melt properties, and processability, making them more versatile and suitable for various applications.   If you have any questions,pls feel free to contact: business@xysjgm.com  

N-phenylmaleimide produced by Yangchen Technology can be used in antifouling of marine warships.The specification is greater than 98%.   Initially, modified acrylic resin (PAZ/ N-PMI). Composite coating samples were prepared by dispersing fluorinated silica-coated hydroxylated multi-walled carbon nanotube nanocomposites (F-MWCNTs-OH@SiO2) in PAZ/N-PMI resin. The composite coating showed good performance, and the antibacterial rate of the composite coating against Staphylococcus aureus and Escherichia coli was >99.98%. When the F-MWCNTs-OH@SiO2 content is 3 wt%, the Zf=0.01Hz of the composite coating reaches the highest value, which is 3 orders of magnitude higher than that of the PAZ/N-PMI coating. At the same time, the prepared composite coating also showed good self-healing properties. This research provides broad application prospects for the development of high-quality marine anti-corrosion and anti-fouling organic coatings.   Acrylic resin coatings play an important role in metal protection due to their low cost, safety, environmental protection, and good weather resistance. However, its poor thermal stability and weak antifouling performance greatly limit its practical application in engineering. However, the metal structures of marine ships and various coastal steel structure engineering equipment have been exposed to complex and harsh marine environments (high salt spray, humidity, strong winds) for a long time. Therefore, corrosive media and external stress will damage the coating surface, causing the coating to crack and fall off. Therefore, the corrosive medium is more likely to penetrate into the coating and reach the metal matrix, causing the protective function of the coating to fail. Therefore, the self-healing function is very important for protective coatings because it can repair damaged parts, extend the protective life, and reduce the maintenance cost of the coating. However, there are few reports on the use of self-healing coatings for marine anticorrosion and antifouling.       Research has demonstrated that embedding bactericidal functional groups into polymers can effectively inhibit microbial adhesion, making it a significant development for antifouling applications. N-phenylmaleimide (N-PMI) has become a hot topic in polymer material modification research due to its good thermal stability, good antibacterial properties, and no environmental pollution. From a structural point of view, N-phenylmaleimide (N-PMI) is a five-membered ring monomer with a 1,2-disublimate vinyl structure. N-PMI can react with acrylic monomers to form polymers. N-PMI is also a heat-resistant polymerizing monomer. Embedding it into the polymer chain can increase the internal ring resistance of the polymer chain, limit the movement of the polymer molecular chain, and improve the thermal stability of acrylic resin. N-PMI has extensive antibacterial activity against microorganisms such as Escherichia coli and Staphylococcus aureus, and can effectively inhibit the reproduction and growth of microorganisms for a long time.   This new acrylic composite coating will effectively reduce marine corrosive media and marine fouling biomass on marine ships and engineering equipment, and increase their service life.   If you have any questions,pls feel free to contact: business@xysjgm.com