The application of N,N’-4,4’-diphenylmethane bismaleimide manufactured by Yangchen Tech in making electronic chips mainly benefits from its excellent high temperature performance and chemical stability.
High temperature stability: BMI has excellent heat resistance and can still maintain stable physical and chemical properties under high temperature conditions. This makes BMI an ideal material for making electronic chips, as high-temperature processing may be required during electronic chip manufacturing, and BMI can show good stability under such conditions.
Low dielectric constant and dielectric loss: BMI has a low dielectric constant and dielectric loss, which means that it can be used as an insulating material in electronic chips, helping to reduce energy loss and interference during signal transmission.
Mechanical strength: BMI resin has high mechanical strength after curing, which can provide good structural support and protection, helping to protect the tiny devices inside the electronic chip from the external environment.
With the above excellent properties, BMI can be well used in the manufacturing of electronic chips. Can be applied in the following aspects:
1. Packaging materials: BMI can be used as packaging materials to protect and encapsulate tiny devices inside electronic chips. BMI resin has excellent heat resistance and chemical stability, can remain stable in high temperature environments, and provides good mechanical strength and protective properties.
2. Backplane material: BMI can be used as a backplane material for electronic chips to provide mechanical support and thermal management for the chip. BMI has good mechanical strength and thermal conductivity, which can effectively disperse and conduct the heat generated by the chip, thereby maintaining the stable operation of the chip.
3. Composite materials: BMI can be combined with other materials to form composite materials, which are used to make substrates or carriers for electronic chips. By adjusting the composition and structure of composite materials, the performance of electronic chips can be optimized, such as improving thermal conductivity and reducing dielectric constant.
4. Insulating materials: BMI has a low dielectric constant and dielectric loss and can be used as an insulating material in electronic chips to help reduce energy loss and interference during signal transmission.
If you have any questions,pls feel free to contact: business@xysjgm.com
Bismaleimide Resins Beyond Epoxy Resins: High-Performance Thermosets Part 1
Bismaleimide resin (BMI) and epoxy resin are both important types of thermosetting resins, but BMI resin shows superiority over epoxy resin in some performance aspects, especially in applications in high-temperature environments. This makes BMI resin a high-performance thermosetting material, especially suitable for areas that require extremely high material performance.
Technical Indicators
Appearance
Melting point
Acid value
Volatile
Specification
Gel time 200℃
Toluene Solubility
Yellow powder
150-160℃
≤1mgKOH/g
≤1%
>98%
<300 S
Totally soluble or a small amount of insoluble matter, transparent solution
1.High temperature stability
BMI resin has excellent high-temperature stability and can maintain the stability of its physical and chemical properties in high-temperature environments. In contrast, the performance of epoxy resins decreases at high temperatures. This gives BMI resin significant advantages in the manufacture of high-temperature components, such as aerospace engines, rocket engines and gas turbines. In these applications, BMI resins maintain the strength and stiffness of the material, ensuring reliable operation at high temperatures.
2. Excellent mechanical properties
In addition to high temperature stability, BMI resins offer excellent mechanical properties, including high strength, high stiffness and high wear resistance. This makes it an ideal structural material, especially suitable for manufacturing high-strength, high-stiffness parts such as aircraft fuselages, car bodies, and ship structures. Compared with epoxy resin, BMI resin shows better performance when withstanding heavy loads and high-speed impacts, which can effectively improve the service life and safety of components.
3. Good chemical stability
BMI resin also has good chemical stability and can resist erosion and corrosion from many chemicals. This makes it an ideal chemical material for use in the manufacture of chemical equipment, storage tanks, and pipes. In corrosive environments, BMI resin can maintain material integrity and performance, ensuring the normal operation and service life of equipment.
4. Easy to process and form
Although BMI resin is slightly more difficult to process than epoxy resin, with appropriate process control and processing methods, BMI resin can still achieve good processing and molding properties. This allows BMI resin to meet the needs of different shapes and sizes, making it possible to manufacture complex parts.
5. Lightweight advantages
BMI resin has a lower density and is lighter than many traditional materials such as steel, aluminum, etc. This gives it an advantage in lightweight design and can be used to create lightweight components and structures. In aerospace, automobile manufacturing and other fields, lightweighting is an important trend. The application of BMI resin helps to reduce the weight of components and improve overall performance.
Bismaleimide resin manufactured by Yangchen Tech shows superiority over epoxy resin in terms of high temperature stability, mechanical properties, chemical stability, processing and molding, and lightweight. This makes BMI resin a high-performance thermosetting material, especially suitable for areas that require extremely high material performance. With the advancement of science and technology and the development of technology, the application prospects of BMI resin will be broader.
If you have any questions,pls feel free to contact: business@xysjgm.com
Reference:https://polymerinnovationblog.com/beyond-epoxy-high-performance-thermosets-part-one