The application of N,N’-4,4’-diphenylmethane bismaleimide manufactured by Yangchen Tech in making electronic chips mainly benefits from its excellent high temperature performance and chemical stability.

High temperature stability: BMI has excellent heat resistance and can still maintain stable physical and chemical properties under high temperature conditions. This makes BMI an ideal material for making electronic chips, as high-temperature processing may be required during electronic chip manufacturing, and BMI can show good stability under such conditions.

Low dielectric constant and dielectric loss: BMI has a low dielectric constant and dielectric loss, which means that it can be used as an insulating material in electronic chips, helping to reduce energy loss and interference during signal transmission.

Mechanical strength: BMI resin has high mechanical strength after curing, which can provide good structural support and protection, helping to protect the tiny devices inside the electronic chip from the external environment.

With the above excellent properties, BMI can be well used in the manufacturing of electronic chips. Can be applied in the following aspects：

1. Packaging materials: BMI can be used as packaging materials to protect and encapsulate tiny devices inside electronic chips. BMI resin has excellent heat resistance and chemical stability, can remain stable in high temperature environments, and provides good mechanical strength and protective properties.

2. Backplane material: BMI can be used as a backplane material for electronic chips to provide mechanical support and thermal management for the chip. BMI has good mechanical strength and thermal conductivity, which can effectively disperse and conduct the heat generated by the chip, thereby maintaining the stable operation of the chip.

3. Composite materials: BMI can be combined with other materials to form composite materials, which are used to make substrates or carriers for electronic chips. By adjusting the composition and structure of composite materials, the performance of electronic chips can be optimized, such as improving thermal conductivity and reducing dielectric constant.

4. Insulating materials: BMI has a low dielectric constant and dielectric loss and can be used as an insulating material in electronic chips to help reduce energy loss and interference during signal transmission.

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