Polyimide resin powder manufactured by Yangchen Tech is a high-performance polymer that is synthesized through a condensation reaction. Its unique molecular structure provides it with excellent resistance to high temperatures, chemicals, and radiation. Unlike traditional adhesives that degrade under extreme heat, polyimide resin powder maintains its integrity, making it the go-to choice for applications where durability under harsh conditions is non-negotiable.   Key Performance Characteristics Of Polyimide Resin Manufactured By Yangchen Tech High-Temperature Stability: Polyimide resin powder exhibits minimal thermal expansion and retains its mechanical strength even when exposed to temperatures exceeding 500°F (260°C). This makes it ideal for bonding components in high-temperature environments. Chemical Resistance: The polymer's aromatic structure provides excellent resistance to chemicals, including acids, bases, and solvents, ensuring that bonds remain intact even in corrosive environments. Electrical Insulation: With its low dielectric constant and high volume resistivity, polyimide resin powder is also widely used in electrical and electronic applications where insulation is critical. Adhesion and Flexibility: Despite its rigidity at high temperatures, polyimide resin powder can be formulated to provide excellent adhesion to a variety of substrates, including metals, ceramics, and glass.   Technical Indicator   Appearance Melting point Partical Size Flowability Gel time Yellow powder 80-110℃ 200-1000 mesh 8-20mm 100-600 S Applications of Polyimide Resin Powder The versatility of polyimide resin powder manufactured by Yangchen Tech is evident in its wide range of applications: Aerospace Industry: Used in bonding components of aircraft and spacecraft where exposure to extreme temperatures is common. Electronic Manufacturing: Employed in the production of printed circuit boards (PCBs), connectors, and other electronic components that require high thermal stability. Automotive Industry: Utilized in the manufacturing of heat-resistant adhesives for engine components and exhaust systems. Industrial Coatings: Applied as a protective coating in high-temperature industrial environments to prevent corrosion and wear. The Advantages of Using Polyimide Resin Powder Compared to traditional adhesives, polyimide resin powder offers several advantages: Outstanding Thermal Durability: Unlike epoxy or silicone-based adhesives, polyimide resin powder does not soften or degrade at high temperatures. Long-Term Reliability: Its chemical and thermal stability ensures that bonds remain strong and intact over time, reducing the need for frequent repairs or replacements. Design Flexibility: Can be formulated to meet specific application requirements, offering a tailored solution for unique challenges.   Polyimide resin powder, with its  thermal stability and versatility, plays a central role in advanced composites and high-temperature fuel cells.For any application where high-temperature stability and reliability are paramount, polyimide resin powder is the premier choice. Its unique combination of thermal, chemical, and mechanical properties makes it an indispensable material for manufacturing. Whether you're seeking to improve the performance of your current products or exploring new design possibilities, polyimide resin powder is the solution you need. Welcome Inquiry!  

In advanced materials engineering, N‑phenylmaleimide (N‑PMI) manuafctured by Yangchen Tech has emerged as a high‑performance monomer for imparting exceptional heat resistance, dimensional stability, and mechanical robustness to a wide range of polymer composites. By introducing a rigid five‑membered maleimide ring with a phenyl substituent, N‑PMI elevates thermal decomposition thresholds, raises Vicat softening points, and improves tensile and flexural properties across ABS, PVC, Nylon 6, epoxy, and polyimide systems.      Why choose N‑Phenylmaleimide? N‑Phenylmaleimide features a planar cyclic imide core that resists chain scission at elevated temperatures, pushing onset decomposition temperatures 20–30 °C higher than conventional styrenic copolymers . Its phenyl ring further imparts steric hindrance, reducing segmental mobility and boosting glass transition temperatures (Tg) by up to 15 °C in polymer blends .   Specification   Appearance Melting point  Purity Solubility Yellow crystalline powder or flakes 85-90℃ ＞99% Soluble in organic solvents   Basic Information     Chemical Structure Chemical Formula C10H7NO2 CAS No. 941-69-5 Molecular Weight 173.16 Packing Type Paper bag (20 kg) Properties Yellow crystalline powder or needles   Core Applications in Polymer Composites   ABS Composites   In ABS/NSM (N‑PMI‑styrene‑maleic anhydride) terpolymers, just 10 wt % N‑PMI elevates heat distortion temperatures (HDT) from ~100 °C to 130 °C, while also increasing tensile strength by 10–15 % and Rockwell hardness by 20 % . Such improvements enable under‑the‑hood automotive parts to maintain dimensional integrity under prolonged high‑temperature exposure .   PVC & PMMA Systems   In PVC‑ABS blends, N‑PMI acts as both a heat‑stabilizer and flame‑retardant, helping formulations meet UL‑94 V‑0 ratings by reducing thermal oxidation and dripping under fire tests .Similarly, incorporating 5–15 wt % N‑PMI in PMMA raises Vicat softening points by 10–20 °C, enhancing optical disc substrates and lighting components for sustained high‑temperature service.   Epoxy & Electronics   When used in epoxy formulations, N‑PMI enhances chemical resistance and reduces warpage under thermal cycling, crucial for printed circuit board encapsulation and high‑power electronics housings. Its inherent flame‑retardancy also helps systems achieve UL‑94 V‑0 compliance without halogenated additives.   Mechanisms of Heat‑Resistance Enhancement   1. Rigid Segments & Cross‑Linking: The maleimide ring creates localized rigidity and potential crosslinks that impede chain mobility, directly lifting glass transition and Vicat points. 2. Thermal Decomposition Delay: Steric hindrance from the phenyl substituent raises the onset of thermal degradation by 20–30 °C, as shown in TGA curves where N‑PMI copolymers retain >90 % mass at 300 °C .   3. Flame Retardancy: The cyclic imide structure promotes char formation and limits dripping, underpinning UL‑94 V‑0 ratings in PVC and epoxy systems .Welcome Inquiry!  

The growing demand for high-performance printed circuit boards (PCBs) has led formulators to seek advanced resin systems that deliver superior thermal, mechanical, and dielectric properties. Phenylmethane maleimide, traded as BMI-200 (CAS 67784-74-1) and also available from Yangchen Tech as BMI-2300 to some Japanese companies, is a modified bismaleimide resin that directly addresses these needs. By adding BMI-200 to copper clad laminates (CCLs), formulators can achieve higher glass transition temperatures (Tg), lower dielectric losses, enhanced dimensional stability, and better copper adhesion, ultimately extending the life and reliability of PCBs in demanding applications such as telecommunications, automotive electronics, and aerospace systems.   1. Overview of Phenylmethane Maleimide (BMI-200) 1.1 Chemical Properties and Structure Chemical Name: Phenylmethane Maleimide CAS: 67784-74-1 Appearance:     1.2 Key Performance Characteristics Thermal Stability: BMI-200 maintains integrity at temperatures above 250°C, minimizing discoloration and degradation of the resin during PCB multilayer lamination High Glass Transition Temperature (Tg): Addition of BMI-200 significantly increases the Tg of the laminated material, ensuring dimensional stability under thermal cycling conditions. Mechanical Strength: BMI-200 provides high modulus and stiffness, reducing CTE mismatch between copper and resin, thereby mitigating warpage and delamination. Chemical Resistance: BMI-200 has excellent resistance to solvents, acids, and moisture, ensuring signal integrity in harsh environments.   Technical Indicators Appearance Softening point Acid value Solubility Brownish-yellow lumps 83℃ 2.42 Clear and transparent   Solubility Solvent ACETONE MEK THF DMF NMP TOLUENE BMI-2300(ref) 50-80 60-80 20-100 ＜80 ＜50 Insoluble   2. Impact on CCL Performance 2.1 Increased Glass Transition Temperature (Tg) A higher Tg of a CCL means that the CCL maintains good mechanical strength at elevated temperatures. If formulated correctly, BMI-200 oligomers can increase Tg to over 210°C, surpassing many standard epoxies.   2.2 Enhanced Dielectric Performance Low dissipation factor (Df) and stable dielectric constant (Dk) are critical for high-speed signal transmission. BMI-200-based laminates have low Df aging rates and controlled dielectric constant temperature coefficients, ensuring minimal signal distortion in the RF and microwave domains.   2.3 Dimensional and Mechanical Stability The high crosslink density imparted by the maleimide groups results in low thermal expansion (Z-axis CTE <1.3%), minimizing interlaminar stress and copper delamination degradation during thermal cycling. Higher copper foil adhesion (>1 N/mm) also improves reliability under mechanical vibration and thermal shock.   2.4 Long-term reliability BMI-200's inherent chemical stability and mechanical integrity extend the life of PCBs. Laminates containing BMI-200 exhibit minimal dendritic delamination patterns and stable interconnect stress test results during long-term aging.   3. Applications in Advanced PCB Technologies High-frequency RF and microwave PCBs: Ideal for telecommunications, satellite communications, and 5G infrastructure due to low dielectric loss and stable dielectric constant (Dk). Automotive electronics: Withstands high temperatures in the engine compartment and supports lead-free soldering processes without resin degradation. Aerospace and defense: High Tg and radiation resistance make BMI-200 laminates suitable for avionics and radar systems.   4. Why choose Yangchen Technology's BMI-200 powder? Yangchen Technology Factory is a leading manufacturer of high-performance resin materials in China. The production process of its BMI-200 phenylmethane maleimide powder follows strict quality control to ensure: Guaranteed purity (≥98%): Minimizes unwanted side reactions and ensures consistent laminate performance Customized particle size distribution: Optimizes dispersion in the resin matrix for uniform cure and mechanical strength Customizable batch production: Supports different oligomerization levels and functionalization levels to meet specific copper clad laminate (CCL) requirements Full technical support: Expert guidance on formulation, process parameters and performance testing   For more information or to request a quote, please Inquiry us!

N-Phenylmaleimide (abbreviated N-PMI), also known as monomaleimide,(C₁₀H₇NO₂, CAS 941-69-5) manufactured by Yangchen Tech used as a high-performance polymer synthetic monomer and modifier.  Structurally, N-PMI features a maleimide ring bonded to a phenyl group, making it highly reactive in both free-radical and ionic polymerizations.  It is produced as a pale yellow crystalline powder (melting point \~88–90 °C) and is valued for its ability to impart heat resistance, mechanical strength, and unique functional properties to resins and plastics.  N-PMI also exhibits photosensitivity and biocidal (disinfectant) activity, which has led to its use as a bactericide, fungicide, and antifouling agent in coatings.     Chemical and Functional Properties   Heat Resistance: N-Phenylmaleimide greatly improves thermal stability when copolymerized with vinyl monomers.  Even small additions (≈1–5% by weight) to ABS, PVC or PMMA resins can raise the heat distortion temperature (HDT) by \~2 °C per wt% of N-PMI.  For example, incorporating 10% N-PMI into ABS can elevate its heat-resistance to about 125–130 °C.  In comparative studies, N-PMI–modified ABS achieved HDT near 150 °C, whereas typical α-methylstyrene modifiers cap around 115 °C.  This high thermal stability makes N-PMI a preferred heat-resistant ABS modifier and engineering polymer additive. Mechanical Properties: N-Phenylmaleimide enhances the mechanical strength and stiffness of polymers.  Copolymers containing N-PMI show higher tensile strength, hardness, and impact resistance than unmodified plastics.  It also improves melt-flow and processability, enabling easier molding and extrusion without degradation.   Specification     Appearance Melting point  Purity Solubility Yellow crystalline powder or flakes 85-90℃ ＞99% Soluble in organic solvents   Chemical and Flame Resistance:  When added to resins, N-PMI increases chemical resistance against acids, bases and solvents.  It also has inherent flame-retardant character; incorporating N-PMI into a polymer matrix can improve the material’s fire resistance, a critical property for electronics and construction applications. Photosensitivity and Biocidal Activity:  N-Phenylmaleimide is used in photosensitive resins and coating formulations due to its ability to undergo UV-initiated polymerization.  Uniquely, it possesses disinfectant properties – it is listed as a *bactericide, fungicide and underwater organism repellent*.  This makes it useful as an antifouling additive in marine coatings and as an intermediate in agricultural chemicals (e.g. plant-growth regulators and pesticides).   Solubility   N-Phenylmaleimide is highly soluble in many organic solvents (e.g. acetone, DMF, benzene), facilitating its use in reactive extrusion and solution polymerizations.  In summary, its combination of heat resistance, mechanical reinforcement, flame-retardancy and biocidal effects make N-phenylmaleimide a versatile monomer and modifier in advanced polymer systems.     Chemical Structure Chemical Formula C10H7NO2 Molecular Weight 173.16 CAS No. 941-69-5 Packing Type Paper bag (20 kg)   Applications in Polymers and Alloys   N-Phenylmaleimide manufactured by Yangchen Tech is primarily used as a comonomer modifier to produce heat-resistant plastic alloys and copolymers.  Heat-Resistant ABS (Acrylonitrile-Butadiene-Styrene):  N-PMI is widely added to ABS resin to create *N-PMI–modified ABS*, often called heat-resistant ABS.  The maleimide group copolymerizes with styrenic monomers, greatly improving HDT and thermal stability.  Even 1% N-PMI raises ABS HDT by \~2 °C.  N-PMI–ABS finds use in automotive parts (dashboards, engine covers), electronics housings and any application requiring high-temperature performance. PVC and PVC/ABS Blends:  Blending N-PMI into PVC or PVC/ABS alloys increases softening temperature and heat deflection.  For example, N-PMI improves the heat resistance of PVC-ABS compounds used in television and office equipment housings. PMMA (Acrylic Resins):  In polymethyl methacrylate (PMMA) and other acrylic resins, N-PMI copolymerization boosts thermal endurance.  N-PMI-modified PMMA is suitable for optical components (discs, lenses) and lighting parts that must withstand higher service temperatures. Engineering Plastic Alloys:  N-PMI is incorporated into blends of engineering plastics such as polyamide (PA), polycarbonate (PC), and PBT.  These polymer alloys – used in automotive and appliance components – gain improved thermal stability from N-PMI modification. Please consult us for more information about N-Phenylmaleimide polymer applications.Welcome Inquiry!  

Improving ABS Heat Resistance: YangchenTech’s Styrene-NPMI-MAH Copolymer   Acrylonitrile-butadiene-styrene (ABS) is a widely used plastic prized for its strength, toughness, and ease of processing. However, its heat resistance is inherently limited.This blog will explain why ABS has these limitations and explore ways to improve its thermal performance—with a focus on chemical modifiers. Next, we’ll explore how YangchenTech’s styrene-NPMI-MAH copolymer, a powerful ABS heat modifier, can significantly improve ABS’s thermal stability.   Styrene-NPMI-MAH Copolymer Manufactured by YANGCHEN TECH  Weicome Inquiry!   Basic Information   Test Item Test Standards Test Data Molecular weight and distribution GPC Mw=12~16*104.PDI=2.0~3.0 Glass transition temperature/℃ DSC 160~210℃(Adjustable) Initial decomposition temperature/℃ TGA 395-405℃ Density  ASTM-D792 1.00~1.15g/cm3 Appearance NG Off-white powder     1.Why is standard ABS heat resistant?   ABS’s modest heat resistance limit stems from its molecular structure. As an amorphous material, it has no clear melting point—above the glass transition temperature (about 100°C), it softens. Even under moderate loads, unreinforced ABS deforms by about 1% at about 88-98°C. This is consistent with industry data: standard ABS can only be used continuously at temperatures around 80°C. In fact, once ABS approaches 100°C, it “becomes very soft and cannot hold its shape under pressure.” Its rubbery butadiene phase (Tg about -90°C) has good impact toughness, but no heat resistance. In short, ABS’s styrene-acrylonitrile matrix is ​​not rigid enough at high temperatures to maintain mechanical properties. As one review notes, ABS’s thermal stability is “quite low,” which limits its use in high-temperature environments, such as unreinforced automotive interiors.   2. Strategies to improve ABS’s thermal performance   To overcome these limitations, engineers have used several strategies:   High-temperature alloys (polymer blends): Blending ABS with engineering plastics with higher Tgs can improve overall heat resistance. For example, ABS/PC alloys (ABS combined with polycarbonate) can be made into materials with higher HDTs than ABS alone. Such blends generally improve tensile strength and stiffness, as well as thermal stability. For this reason, ABS-PC filaments are popular in the 3D printing community. Reinforced composites: Adding inorganic fillers can significantly increase ABS’s HDT. Glass fibers are particularly effective—about 30% glass fiber filler can increase ABS’s heat distortion temperature (HDT) by about 40°C (e.g., from about 90°C to about 130°C) by forming a thermally stable network. Talc or mica fillers can slightly increase the heat distortion temperature (about 10-15°C) by forming a heat-insulating layer. These reinforcements also increase stiffness, but may reduce impact strength. Heat stabilizers: Additives such as hindered phenol antioxidants or organometallic stabilizers can slow down the thermal oxidation of ABS, extending its service life at high temperatures. Flame retardant additives (bromine-based or phosphorus-based) not only reduce flammability but also enhance thermal stability, thereby increasing the distortion temperature of ABS. Annealing and processing: Careful processing (such as annealing molded parts) can relieve internal stresses and improve heat distortion performance. Optimizing mold design and curing conditions can also help parts withstand higher service temperatures. Chemical modification: Arguably the most effective method is to modify the ABS polymer itself, either by copolymerization or grafting. Introducing rigid monomers into the ABS backbone can significantly increase its Tg and heat distortion performance. This led us to develop Styrene-NPMI-MAH terpolymers, a class of heat-resistant ABS modifiers developed and produced by Yangchen Tech.   3. Styrene-NPMI-MAH copolymer: a high-performance ABS modifier   Styrene-NPMI-MAH copolymer (also known as NSM copolymer) is a random terpolymer of styrene, N-phenylmaleimide (NPMI), and maleic anhydride (MAH). Its high heat resistance comes from its aromatic rigid NPMI units and polar MAH groups. YangchenTech's copolymers can be formulated to have glass transition temperatures well above 150°C.     N-Phenylmaleimide Manufactured by YANGCHEN TECH Weicome Inquiry! Specification     Property Limits Results Appearance Yellow powder Yellow powder Purity % >98 99.5 Melting Range ℃ >85 88~90   NPMI-styrene-MAH copolymer (about 47% NPMI content in the composition) has a glass transition temperature (Tg) of about 190°C. When mixed with ABS, the effect is significant: Vicat softening point, tensile strength, and flexural strength all increase with increasing addition of NSM copolymer.   Any technical support,pls contact us!      

Polyimide resin Powder manufactured by Yangchen Tech plays a critical role in advanced friction materials by serving as the high-performance binder or matrix that holds together reinforcing fibers and fillers. Its outstanding thermal stability, wear resistance, and ability to maintain a stable coefficient of friction under changing loads and temperatures make it an ideal replacement for conventional phenolic systems in demanding applications.     High-Temperature Resistance & Thermal StabilityFriction interfaces—such as brake pads and clutch plates—can reach temperatures above 300 °C during heavy or repeated braking. Polyimide resin maintains mechanical integrity and frictional properties at these temperatures, preventing “fade” (loss of braking performance) and extending service life.  Abrasion & Wear ResistanceThe inherently high hardness and chemical resistance of polyimide help reduce material loss under sliding contact. Composites formulated with polyimide binders show lower wear rates compared to phenolic-based friction materials, translating to longer intervals between replacements.  Stable Coefficient of FrictionPolyimide-based composites exhibit minimal variation in friction coefficient across a wide temperature range, ensuring predictable braking or clutch engagement without judder, chatter, or noise. Modifications—such as adding graphite or ceramic fillers—can further tune friction levels for specific applications.  Applications Automotive & Heavy-Duty Brakes: Pads and linings for performance vehicles, trucks, and off-road equipment that demand high fade resistance. Aerospace Brake Systems: Carbon-carbon or carbon-ceramic discs often use polyimide matrix composites for landing-gear and wheel brakes, where weight savings and thermal endurance are paramount. Industrial Machinery: Clutches and brakes in stamping presses, mining equipment, and wind-power generators benefit from the resin’s durability under high loads. Grinding Wheels & Cutting Tools: As a binder for superabrasive (diamond, CBN) wheels, polyimide delivers improved wheel life and cutting consistency at elevated operating temperatures. Processing & FabricationTypical manufacturing methods include hot molding, cold/hot isostatic pressing, and even advanced techniques like injection molding or 3D printing of pre-ceramic precursors. These processes allow precise control of resin/filler ratios and part geometry.    When you need friction materials that can withstand extreme heat, deliver consistent braking performance, and offer superior wear life, polyimide resin — often filled with fibers (e.g., aramid, carbon) and solid lubricants (e.g., graphite, MoS₂) — is the binder of choice for next-generation brake pads, clutch facings, industrial brakes, and superabrasive tools.

Phenylmethane bismaleimide BMI-200 (Other name:BMI-2300) ,CAS 67784-74-1) manufactured by Yangchen Tech is a high-performance thermoset resin for demanding aerospace, electronics, adhesives and composite applications. It is an aromatic bismaleimide (BMI) resin known for its excellent thermal stability, mechanical strength and chemical resistance. BMI-200 is typically supplied as a tan crystalline powder and cures to form a hard glassy network with a very high glass transition temperature (typically >250°C) and very low volatile by-products.   Physical Properties Appearance and physical properties: tan crystalline powder (softening point ≈83°C; melting point ≈150-160°C). Density ≈1.22g/cm³. Very low volatile matter content (<1%). Thermal properties: Glass transition temperature ~287°C (DMA); maintains integrity above 250°C. 5% weight loss at around 408°C indicates excellent heat resistance. BMI-2300 cures by addition (Michael/ene reaction) with no volatile byproducts. Mechanical properties: High flexural strength (about 204MPa at room temperature) and stiffness (flexural modulus about 4.4GPa at room temperature). Barcol hardness about 59. High modulus and strength are maintained at elevated temperatures. Electrical properties: Dielectric constant ≈ 3.1, loss tangent ≈ 0.012 (GHz frequency), making it ideal for high-speed/high-frequency electronic devices. High insulation resistance and low dielectric loss. Chemical properties: Acid value about 2.4mgKOH/g. Excellent resistance to solvents, fuels, and moisture. Insoluble in non-polar solvents (e.g. toluene), but soluble in highly polar aprotic solvents (THF, DMF, MEK).   Technical Indicators   Appearance Softening point Acid value Solubility Brownish-yellow lumps 60-120℃ ＜10 50% transparent solution (ketone solvent)   Solubility   Solvent ACETONE MEK THF DMF NMP TOLUENE Phenylmethane bismaleimide 50-80 60-80 20-100 ＜80 ＜50 Insoluble     Benefits of Phenylmethane bismaleimide  BMI-200   Exceptional Thermal Stability: Maintains structural integrity well above 250°C (glass transition ~287°C). Minimizes discoloration and degradation in high-temperature service. Ideal for jet-engine components, turbine parts and high-speed electronic devices. High Mechanical Performance: High modulus and strength even at elevated temperatures. Improves stiffness and fatigue life of composite parts. Resists deformation under load, enhancing reliability of structural laminates and housings. Chemical & Environmental Resistance: Aromatic imide backbone provides excellent resistance to fuels, solvents, acids and moisture. Enables long-term stability in aviation fuels, hydraulic fluids, and corrosive environments. Low moisture uptake improves dimension stability in humid conditions. Electrical & Dielectric Advantages: Low dielectric constant/loss makes BMI-2300 ideal for RF/microwave circuit boards and high-voltage insulation. Ensures signal integrity and insulation strength in harsh environments. High Tg also raises the operating temperature of laminates, improving thermal cycling reliability. Manufacturing Reliability: Cures via addition chemistry without evolving gases, so parts have minimal voiding or blistering. Improves bond adhesion (e.g. to copper foil in PCBs) and composite consolidation. Reduces processing defects compared to condensation thermosets. Lightweight, Flame-Resistant: Enables weight reduction in aerospace/electronics versus metal alternatives while providing inherent flame retardancy (aromatic structures are self-extinguishing). Helps OEMs meet stringent FAR/FMVSS fire, smoke and toxicity requirements.