Styrene Maleic Anhydride Copolymer (SMA Copolymer) manufactured by Yangchen Tech is a highly versatile and widely used thermoplastic copolymer that combines the benefits of styrene and maleic anhydride. SMA is produced by copolymerizing styrene with maleic anhydride, resulting in a polymer that exhibits excellent chemical resistance, high thermal stability, and superior adhesion properties. Due to its unique properties, SMA has become an essential component in various industrial applications, particularly in plastics manufacturing. Styrene Maleic Anhydride Copolymer produced by Yangchen Tech  can help your products with strong bonding, high impact resistance, and enhanced durability,which can improve the performance of materials, especially in the plastic industry, makes it a go-to solution for manufacturers seeking to elevate the functionality of their products.     Basic Information   Test Item Test Standards Test Data Molecular weight and distribution GPC Mw=12~16*104.PDI=2.0~3.0 Glass transition temperature/℃ DSC 160~210℃(Adjustable) Initial decomposition temperature/℃ TGA 395-405℃ Density  ASTM-D792 1.00~1.15g/cm3 Appearance NG Off-white powder     Applications of Styrene Maleic Anhydride Copolymer in Plastics Manufacturing 1. Enhancing Impact Resistance in Plastics SMA Copolymer plays a critical role in enhancing the impact resistance of plastic products. It is often used as a modifier in the production of engineering plastics, such as ABS (Acrylonitrile Butadiene Styrene) and polystyrene. When added to these materials, SMA copolymer significantly improves their strength and durability without compromising flexibility. This makes it an essential ingredient in producing products that need to withstand stress, impact, and high temperatures.   2. Adhesive and Coating Applications The high reactivity of SMA makes it an excellent choice for adhesives and coatings. By combining SMA with other resins or polymers, manufacturers can create strong, durable bonding agents. This is particularly useful in industries where adhesive strength and resistance to environmental factors are critical. Whether it's in automotive applications, electronics, or packaging, SMA-based adhesives provide a reliable solution for manufacturers.   3. Plastic Alloying and Blending SMA is widely used to enhance the properties of plastic alloys. It acts as a compatibilizer, helping to blend otherwise incompatible polymers. In plastics, SMA improves the overall processing capabilities and enhances mechanical properties, especially when combined with high-performance polymers like polycarbonate (PC), polyphenylene oxide (PPO), or polyphenylene sulfide (PPS). By creating a more homogenous blend, SMA improves the structural integrity of plastic parts used in demanding environments.       4. Applications in Automotive Plastics The automotive industry relies heavily on advanced materials that offer durability, strength, and resistance to heat and wear. SMA Copolymer is often used in automotive applications such as interior trim, bumpers, and other plastic components. Its ability to improve impact resistance, along with its excellent thermal stability, makes it an ideal choice for manufacturing durable automotive parts that can withstand extreme conditions.   5. Medical Plastics and Devices Styrene Maleic Anhydride Copolymer ’s high purity and biocompatibility make it suitable for use in medical devices and equipment. Its excellent chemical resistance ensures that medical plastics maintain their integrity when exposed to harsh cleaning agents or sterilization processes. Additionally, its strong bonding ability makes it ideal for creating medical products that require long-lasting durability.   Why Choose Styrene Maleic Anhydride Copolymer for Your Plastic Manufacturing Needs? Enhanced Performance: SMA Copolymer boosts the performance of plastics by improving impact resistance, adhesion strength, and thermal stability. Customization: It can be tailored for specific applications, offering flexibility in plastic product development. Cost-Effectiveness: By improving material properties and enabling better processing techniques, SMA helps reduce manufacturing costs in the long run. Sustainability:Styrene Maleic Anhydride Copolymer  efficient bonding properties can lead to lighter and more durable plastic products, supporting sustainable manufacturing practices by reducing waste and material usage. Any questions,feel free to contact:business@xysjgm.com OUR WAREHOUSE Whatever you needs, YANGCHEN TECH is at your side. OUR WAREHOUSE Whatever you needs, YANGCHEN TECH is at your side. OUR WAREHOUSE Whatever you needs, YANGCHEN TECH is at your side.      

N-Phenylmaleimide 99.7% Purity, manufactured by Yangchen Tech, is a high-performance monomer widely used to enhance the heat resistance and mechanical properties of ABS and PVC resins. With its superior 99.7% purity, this compound offers unmatched consistency, performance, and reliability in a range of industrial applications.     Specification   N-phenylmaleimide 941-69-5 Test Specification Apperance Light yellow to Yellow powder to lump Purity min. 99.0 %  Melting Point 85.0 to 90.0 °C  Solubility in Methanol  Practically transparent Water Content wt% 0.1 max.   Why Choose N-Phenylmaleimide 99.7% Purity? The high purity of N-Phenylmaleimide 99.7% Purity is crucial for achieving optimal results in resin modification, especially in materials like ABS (Acrylonitrile Butadiene Styrene) and PVC (Polyvinyl Chloride). When added to these resins, NPMI helps to significantly increase heat resistance, improve processing capabilities, and enhance mechanical strength—all critical properties for durable and high-performance products.   Applications of N-Phenylmaleimide in ABS and PVC Resins: Enhanced Heat Resistance: When incorporated into ABS and PVC resins, N-phenylmaleimide raises the heat distortion temperature (HDT) of the material, making it more resistant to high-temperature environments. This is especially beneficial for products in industries such as automotive, electronics, and construction, where heat exposure is common. Improved Mechanical Properties: N-phenylmaleimide strengthens the tensile strength and hardness of ABS and PVC resins, resulting in more durable and wear-resistant materials. This modification is crucial for creating products that withstand mechanical stress, such as automotive parts, electrical components, and piping systems. Better Processability: By enhancing the flow properties of ABS and PVC resins, N-Phenylmaleimide 99.7% Purity improves their moldability and extrudability, making them easier to process into complex shapes and designs. Cost-Effective Performance: With Yangchen Tech's N-phenylmaleimide, manufacturers can achieve superior resin modification without significantly increasing production costs. The 99.7% purity ensures high efficiency in small quantities, making it a cost-effective solution for large-scale production.   Why Choose Yangchen Tech for N-Phenylmaleimide 99.7% Purity? As a supplier of high-quality N-phenylmaleimide, Yangchen Tech offers consistent product quality and excellent customer support of N-Phenylmaleimide 99.7% Purity. Our N-phenylmaleimide is sourced from advanced manufacturing processes and undergoes rigorous quality control, ensuring that every batch delivers the 99.7% purity that our clients rely on. With extensive experience in providing custom solutions and technical support, Yangchen Tech is committed to helping you enhance the performance of ABS and PVC resins, making them more heat-resistant, durable, and versatile for a wide range of applications.

When it comes to advanced materials, N-Phenylmaleimide (N-PMI) stands out as a key additive for enhancing heat resistance and thermal stability in various polymer applications. As a trusted manufacturer and global supplier, Yangchen Tech delivers high-purity N-Phenylmaleimide (up to 99.7%) .     Why Choose Yangchen Tech’s N-Phenylmaleimide?   ✔ Exceptional Heat Resistance – Enhances ABS, PVC, and other engineering plastics, significantly improving HDT (Heat Distortion Temperature). ✔ High Purity (99.7%) – Ensures optimal efficiency in modifying polymers and coatings. ✔ Versatile Applications – Widely used in high-performance plastics, coatings, adhesives, and synthetic rubber. ✔ Reliable Global Supplier – With years of expertise in specialty chemicals and polymer additives, Yangchen Tech guarantees consistent quality and supply stability.   Basic Information     Chemical Structure Chemical Formula C10H7NO2 CAS No. 941-69-5 Molecular Weight 173.16 Packing Type Paper bag (20 kg) Properties Yellow crystalline powder or needles     Applications of N-Phenylmaleimide manufactured by Yangchen Tech   🔹 ABS & PVC Heat-Resistant Modification – Improves thermal stability and extends service life. 🔹 Paints & Coatings – Enhances heat and chemical resistance for long-lasting finishes. 🔹 Adhesives & Composites – Ensures stronger bonding performance under high temperatures. 🔹 Pharmaceutical & Agrochemical Intermediates – Used in specialty chemical synthesis.   Looking for a Reliable N-Phenylmaleimide Supplier? Let’s Connect! At Yangchen Tech, we focus on quality, innovation, and customer satisfaction. Whether you need customized specifications, bulk supply, or technical support, we are here to meet your needs.   💬 Interested in our N-Phenylmaleimide? Contact us today for a quote, free sample, or technical consultation! Let’s explore how our advanced materials can enhance your applications.   📩 Get in Touch Now!

Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane (CAS 105391-33-1), a highperformance bismaleimide (BMI) monomer manufactured by Yangchen Tech, has emerged as a gamechanger in advanced polymer science. Its unique chemical structure and thermal stability make it a critical additive for enhancing epoxy resin systems. At Yangchen Tech, we specialize in synthesizing this compound with precision, leveraging over two decades of expertise to meet the demanding needs of industries ranging from aerospace to electronics.       Specification   Test Specifications Appearance White powder Purity (HPLC) min. 97.0 area% Purity (with Total Nitrogen) min. 98.0 % Melting point 163.0 to 167.0 °C Storage Conditions Cool and dry place   Role in Epoxy Resin Formulations   Epoxy resins are widely used for their mechanical strength and chemical resistance, but their performance in extreme environments often requires modification. Here’s how this BMI monomer elevates epoxy systems:   1. Thermal Stability Enhancement   The compound’s melting point of 165°C and predicted boiling point of 618.7°C ensure compatibility with hightemperature curing processes.   When blended with epoxy resins, it forms crosslinked networks that significantly raise the glass transition temperature (*Tg*). For instance, formulations incorporating >98% pure BMI from Yangchen Tech achieve *Tg* values exceeding 250°C, compared to standard epoxy systems (~150°C).   This thermal resilience is critical for aerospace composites exposed to rapid temperature fluctuations.     2. Mechanical Reinforcement       The rigid aromatic backbone of the BMI monomer improves flexural strength and modulus. Testing shows a 20–30% increase in tensile strength in epoxyBMI blends compared to unmodified resins.       Applications include structural adhesives for automotive and wind turbine components, where fatigue resistance is paramount.     3. Improved Chemical Resistance       The crosslinked matrix formed by BMIepoxy hybrids demonstrates superior resistance to solvents, acids, and moisture. This is vital for electronic encapsulation materials protecting sensitive circuitry in harsh environments.     Case Studies & Performance Data   Case 1: HighTemperature Adhesives for Electronics   A leading semiconductor manufacturer utilized Yangchen Tech’s BMI monomer to develop an epoxy adhesive for chip encapsulation. Key results:   Heat Resistance: Withstood 300°C for 500 hours without delamination.   Dielectric Properties: Maintained a dielectric constant below 3.2 at 1 MHz, ideal for highfrequency applications.     Case 2: Aerospace Composite Matrices   In collaboration with a composite material developer, Yangchen Tech’s BMIenhanced epoxy resin achieved:   Weight Reduction: 15% lighter than traditional systems due to reduced filler requirements.   Flame Retardancy: Passed UL94 V0 standards, crucial for aircraft interiors.       Technical Advantages of Yangchen Tech’s BMI Monomer   1. Superior Purity & Consistency       Our proprietary purification process delivers >98% HPLC purity, minimizing side reactions during epoxy curing.       Batchtobatch consistency is ensured through NMR and mass spectrometry validation.     2. Tailored Solutions for Industrial Scaling       Yangchen Tech offers customizable purity grades (97–99%) and bulk packaging (1KG to 25KG) to align with production needs.       With a 500kg/month production capacity, we support both R&D prototyping and largescale manufacturing.     3. Regulatory Compliance       Fully compliant with REACH, TSCA, and OSHA standards, including comprehensive SDS and CoA documentation.     Why Partner with Yangchen Tech?   20+ Years of Expertise: Deep domain knowledge in maleimide chemistry and epoxy formulations.   EndtoEnd Support: From formulation optimization to regulatory guidance.   Global Logistics: Reliable delivery with expedited shipping options.     Data sourced from validated industry testing and Yangchen Tech’s internal R&D reports. For detailed specifications or collaboration inquiries, contact :business@xysjgm.com

Polyimide resin powder manufactured by Yangchen Tech is a high-performance polymer that is synthesized through a condensation reaction. Its unique molecular structure provides it with excellent resistance to high temperatures, chemicals, and radiation. Unlike traditional adhesives that degrade under extreme heat, polyimide resin powder maintains its integrity, making it the go-to choice for applications where durability under harsh conditions is non-negotiable.   Key Performance Characteristics Of Polyimide Resin Manufactured By Yangchen Tech High-Temperature Stability: Polyimide resin powder exhibits minimal thermal expansion and retains its mechanical strength even when exposed to temperatures exceeding 500°F (260°C). This makes it ideal for bonding components in high-temperature environments. Chemical Resistance: The polymer's aromatic structure provides excellent resistance to chemicals, including acids, bases, and solvents, ensuring that bonds remain intact even in corrosive environments. Electrical Insulation: With its low dielectric constant and high volume resistivity, polyimide resin powder is also widely used in electrical and electronic applications where insulation is critical. Adhesion and Flexibility: Despite its rigidity at high temperatures, polyimide resin powder can be formulated to provide excellent adhesion to a variety of substrates, including metals, ceramics, and glass.   Technical Indicator   Appearance Melting point Partical Size Flowability Gel time Yellow powder 80-110℃ 200-1000 mesh 8-20mm 100-600 S Applications of Polyimide Resin Powder The versatility of polyimide resin powder manufactured by Yangchen Tech is evident in its wide range of applications: Aerospace Industry: Used in bonding components of aircraft and spacecraft where exposure to extreme temperatures is common. Electronic Manufacturing: Employed in the production of printed circuit boards (PCBs), connectors, and other electronic components that require high thermal stability. Automotive Industry: Utilized in the manufacturing of heat-resistant adhesives for engine components and exhaust systems. Industrial Coatings: Applied as a protective coating in high-temperature industrial environments to prevent corrosion and wear. The Advantages of Using Polyimide Resin Powder Compared to traditional adhesives, polyimide resin powder offers several advantages: Outstanding Thermal Durability: Unlike epoxy or silicone-based adhesives, polyimide resin powder does not soften or degrade at high temperatures. Long-Term Reliability: Its chemical and thermal stability ensures that bonds remain strong and intact over time, reducing the need for frequent repairs or replacements. Design Flexibility: Can be formulated to meet specific application requirements, offering a tailored solution for unique challenges.   Polyimide resin powder, with its  thermal stability and versatility, plays a central role in advanced composites and high-temperature fuel cells.For any application where high-temperature stability and reliability are paramount, polyimide resin powder is the premier choice. Its unique combination of thermal, chemical, and mechanical properties makes it an indispensable material for manufacturing. Whether you're seeking to improve the performance of your current products or exploring new design possibilities, polyimide resin powder is the solution you need. Welcome Inquiry!  

In advanced materials engineering, N‑phenylmaleimide (N‑PMI) manuafctured by Yangchen Tech has emerged as a high‑performance monomer for imparting exceptional heat resistance, dimensional stability, and mechanical robustness to a wide range of polymer composites. By introducing a rigid five‑membered maleimide ring with a phenyl substituent, N‑PMI elevates thermal decomposition thresholds, raises Vicat softening points, and improves tensile and flexural properties across ABS, PVC, Nylon 6, epoxy, and polyimide systems.      Why choose N‑Phenylmaleimide? N‑Phenylmaleimide features a planar cyclic imide core that resists chain scission at elevated temperatures, pushing onset decomposition temperatures 20–30 °C higher than conventional styrenic copolymers . Its phenyl ring further imparts steric hindrance, reducing segmental mobility and boosting glass transition temperatures (Tg) by up to 15 °C in polymer blends .   Specification   Appearance Melting point  Purity Solubility Yellow crystalline powder or flakes 85-90℃ ＞99% Soluble in organic solvents   Basic Information     Chemical Structure Chemical Formula C10H7NO2 CAS No. 941-69-5 Molecular Weight 173.16 Packing Type Paper bag (20 kg) Properties Yellow crystalline powder or needles   Core Applications in Polymer Composites   ABS Composites   In ABS/NSM (N‑PMI‑styrene‑maleic anhydride) terpolymers, just 10 wt % N‑PMI elevates heat distortion temperatures (HDT) from ~100 °C to 130 °C, while also increasing tensile strength by 10–15 % and Rockwell hardness by 20 % . Such improvements enable under‑the‑hood automotive parts to maintain dimensional integrity under prolonged high‑temperature exposure .   PVC & PMMA Systems   In PVC‑ABS blends, N‑PMI acts as both a heat‑stabilizer and flame‑retardant, helping formulations meet UL‑94 V‑0 ratings by reducing thermal oxidation and dripping under fire tests .Similarly, incorporating 5–15 wt % N‑PMI in PMMA raises Vicat softening points by 10–20 °C, enhancing optical disc substrates and lighting components for sustained high‑temperature service.   Epoxy & Electronics   When used in epoxy formulations, N‑PMI enhances chemical resistance and reduces warpage under thermal cycling, crucial for printed circuit board encapsulation and high‑power electronics housings. Its inherent flame‑retardancy also helps systems achieve UL‑94 V‑0 compliance without halogenated additives.   Mechanisms of Heat‑Resistance Enhancement   1. Rigid Segments & Cross‑Linking: The maleimide ring creates localized rigidity and potential crosslinks that impede chain mobility, directly lifting glass transition and Vicat points. 2. Thermal Decomposition Delay: Steric hindrance from the phenyl substituent raises the onset of thermal degradation by 20–30 °C, as shown in TGA curves where N‑PMI copolymers retain >90 % mass at 300 °C .   3. Flame Retardancy: The cyclic imide structure promotes char formation and limits dripping, underpinning UL‑94 V‑0 ratings in PVC and epoxy systems .Welcome Inquiry!  

The growing demand for high-performance printed circuit boards (PCBs) has led formulators to seek advanced resin systems that deliver superior thermal, mechanical, and dielectric properties. Phenylmethane maleimide, traded as BMI-200 (CAS 67784-74-1) and also available from Yangchen Tech as BMI-2300 to some Japanese companies, is a modified bismaleimide resin that directly addresses these needs. By adding BMI-200 to copper clad laminates (CCLs), formulators can achieve higher glass transition temperatures (Tg), lower dielectric losses, enhanced dimensional stability, and better copper adhesion, ultimately extending the life and reliability of PCBs in demanding applications such as telecommunications, automotive electronics, and aerospace systems.   1. Overview of Phenylmethane Maleimide (BMI-200) 1.1 Chemical Properties and Structure Chemical Name: Phenylmethane Maleimide CAS: 67784-74-1 Appearance:     1.2 Key Performance Characteristics Thermal Stability: BMI-200 maintains integrity at temperatures above 250°C, minimizing discoloration and degradation of the resin during PCB multilayer lamination High Glass Transition Temperature (Tg): Addition of BMI-200 significantly increases the Tg of the laminated material, ensuring dimensional stability under thermal cycling conditions. Mechanical Strength: BMI-200 provides high modulus and stiffness, reducing CTE mismatch between copper and resin, thereby mitigating warpage and delamination. Chemical Resistance: BMI-200 has excellent resistance to solvents, acids, and moisture, ensuring signal integrity in harsh environments.   Technical Indicators Appearance Softening point Acid value Solubility Brownish-yellow lumps 83℃ 2.42 Clear and transparent   Solubility Solvent ACETONE MEK THF DMF NMP TOLUENE BMI-2300(ref) 50-80 60-80 20-100 ＜80 ＜50 Insoluble   2. Impact on CCL Performance 2.1 Increased Glass Transition Temperature (Tg) A higher Tg of a CCL means that the CCL maintains good mechanical strength at elevated temperatures. If formulated correctly, BMI-200 oligomers can increase Tg to over 210°C, surpassing many standard epoxies.   2.2 Enhanced Dielectric Performance Low dissipation factor (Df) and stable dielectric constant (Dk) are critical for high-speed signal transmission. BMI-200-based laminates have low Df aging rates and controlled dielectric constant temperature coefficients, ensuring minimal signal distortion in the RF and microwave domains.   2.3 Dimensional and Mechanical Stability The high crosslink density imparted by the maleimide groups results in low thermal expansion (Z-axis CTE <1.3%), minimizing interlaminar stress and copper delamination degradation during thermal cycling. Higher copper foil adhesion (>1 N/mm) also improves reliability under mechanical vibration and thermal shock.   2.4 Long-term reliability BMI-200's inherent chemical stability and mechanical integrity extend the life of PCBs. Laminates containing BMI-200 exhibit minimal dendritic delamination patterns and stable interconnect stress test results during long-term aging.   3. Applications in Advanced PCB Technologies High-frequency RF and microwave PCBs: Ideal for telecommunications, satellite communications, and 5G infrastructure due to low dielectric loss and stable dielectric constant (Dk). Automotive electronics: Withstands high temperatures in the engine compartment and supports lead-free soldering processes without resin degradation. Aerospace and defense: High Tg and radiation resistance make BMI-200 laminates suitable for avionics and radar systems.   4. Why choose Yangchen Technology's BMI-200 powder? Yangchen Technology Factory is a leading manufacturer of high-performance resin materials in China. The production process of its BMI-200 phenylmethane maleimide powder follows strict quality control to ensure: Guaranteed purity (≥98%): Minimizes unwanted side reactions and ensures consistent laminate performance Customized particle size distribution: Optimizes dispersion in the resin matrix for uniform cure and mechanical strength Customizable batch production: Supports different oligomerization levels and functionalization levels to meet specific copper clad laminate (CCL) requirements Full technical support: Expert guidance on formulation, process parameters and performance testing   For more information or to request a quote, please Inquiry us!

N-Phenylmaleimide (abbreviated N-PMI), also known as monomaleimide,(C₁₀H₇NO₂, CAS 941-69-5) manufactured by Yangchen Tech used as a high-performance polymer synthetic monomer and modifier.  Structurally, N-PMI features a maleimide ring bonded to a phenyl group, making it highly reactive in both free-radical and ionic polymerizations.  It is produced as a pale yellow crystalline powder (melting point \~88–90 °C) and is valued for its ability to impart heat resistance, mechanical strength, and unique functional properties to resins and plastics.  N-PMI also exhibits photosensitivity and biocidal (disinfectant) activity, which has led to its use as a bactericide, fungicide, and antifouling agent in coatings.     Chemical and Functional Properties   Heat Resistance: N-Phenylmaleimide greatly improves thermal stability when copolymerized with vinyl monomers.  Even small additions (≈1–5% by weight) to ABS, PVC or PMMA resins can raise the heat distortion temperature (HDT) by \~2 °C per wt% of N-PMI.  For example, incorporating 10% N-PMI into ABS can elevate its heat-resistance to about 125–130 °C.  In comparative studies, N-PMI–modified ABS achieved HDT near 150 °C, whereas typical α-methylstyrene modifiers cap around 115 °C.  This high thermal stability makes N-PMI a preferred heat-resistant ABS modifier and engineering polymer additive. Mechanical Properties: N-Phenylmaleimide enhances the mechanical strength and stiffness of polymers.  Copolymers containing N-PMI show higher tensile strength, hardness, and impact resistance than unmodified plastics.  It also improves melt-flow and processability, enabling easier molding and extrusion without degradation.   Specification     Appearance Melting point  Purity Solubility Yellow crystalline powder or flakes 85-90℃ ＞99% Soluble in organic solvents   Chemical and Flame Resistance:  When added to resins, N-PMI increases chemical resistance against acids, bases and solvents.  It also has inherent flame-retardant character; incorporating N-PMI into a polymer matrix can improve the material’s fire resistance, a critical property for electronics and construction applications. Photosensitivity and Biocidal Activity:  N-Phenylmaleimide is used in photosensitive resins and coating formulations due to its ability to undergo UV-initiated polymerization.  Uniquely, it possesses disinfectant properties – it is listed as a *bactericide, fungicide and underwater organism repellent*.  This makes it useful as an antifouling additive in marine coatings and as an intermediate in agricultural chemicals (e.g. plant-growth regulators and pesticides).   Solubility   N-Phenylmaleimide is highly soluble in many organic solvents (e.g. acetone, DMF, benzene), facilitating its use in reactive extrusion and solution polymerizations.  In summary, its combination of heat resistance, mechanical reinforcement, flame-retardancy and biocidal effects make N-phenylmaleimide a versatile monomer and modifier in advanced polymer systems.     Chemical Structure Chemical Formula C10H7NO2 Molecular Weight 173.16 CAS No. 941-69-5 Packing Type Paper bag (20 kg)   Applications in Polymers and Alloys   N-Phenylmaleimide manufactured by Yangchen Tech is primarily used as a comonomer modifier to produce heat-resistant plastic alloys and copolymers.  Heat-Resistant ABS (Acrylonitrile-Butadiene-Styrene):  N-PMI is widely added to ABS resin to create *N-PMI–modified ABS*, often called heat-resistant ABS.  The maleimide group copolymerizes with styrenic monomers, greatly improving HDT and thermal stability.  Even 1% N-PMI raises ABS HDT by \~2 °C.  N-PMI–ABS finds use in automotive parts (dashboards, engine covers), electronics housings and any application requiring high-temperature performance. PVC and PVC/ABS Blends:  Blending N-PMI into PVC or PVC/ABS alloys increases softening temperature and heat deflection.  For example, N-PMI improves the heat resistance of PVC-ABS compounds used in television and office equipment housings. PMMA (Acrylic Resins):  In polymethyl methacrylate (PMMA) and other acrylic resins, N-PMI copolymerization boosts thermal endurance.  N-PMI-modified PMMA is suitable for optical components (discs, lenses) and lighting parts that must withstand higher service temperatures. Engineering Plastic Alloys:  N-PMI is incorporated into blends of engineering plastics such as polyamide (PA), polycarbonate (PC), and PBT.  These polymer alloys – used in automotive and appliance components – gain improved thermal stability from N-PMI modification. Please consult us for more information about N-Phenylmaleimide polymer applications.Welcome Inquiry!  

Improving ABS Heat Resistance: YangchenTech’s Styrene-NPMI-MAH Copolymer   Acrylonitrile-butadiene-styrene (ABS) is a widely used plastic prized for its strength, toughness, and ease of processing. However, its heat resistance is inherently limited.This blog will explain why ABS has these limitations and explore ways to improve its thermal performance—with a focus on chemical modifiers. Next, we’ll explore how YangchenTech’s styrene-NPMI-MAH copolymer, a powerful ABS heat modifier, can significantly improve ABS’s thermal stability.   Styrene-NPMI-MAH Copolymer Manufactured by YANGCHEN TECH  Weicome Inquiry!   Basic Information   Test Item Test Standards Test Data Molecular weight and distribution GPC Mw=12~16*104.PDI=2.0~3.0 Glass transition temperature/℃ DSC 160~210℃(Adjustable) Initial decomposition temperature/℃ TGA 395-405℃ Density  ASTM-D792 1.00~1.15g/cm3 Appearance NG Off-white powder     1.Why is standard ABS heat resistant?   ABS’s modest heat resistance limit stems from its molecular structure. As an amorphous material, it has no clear melting point—above the glass transition temperature (about 100°C), it softens. Even under moderate loads, unreinforced ABS deforms by about 1% at about 88-98°C. This is consistent with industry data: standard ABS can only be used continuously at temperatures around 80°C. In fact, once ABS approaches 100°C, it “becomes very soft and cannot hold its shape under pressure.” Its rubbery butadiene phase (Tg about -90°C) has good impact toughness, but no heat resistance. In short, ABS’s styrene-acrylonitrile matrix is ​​not rigid enough at high temperatures to maintain mechanical properties. As one review notes, ABS’s thermal stability is “quite low,” which limits its use in high-temperature environments, such as unreinforced automotive interiors.   2. Strategies to improve ABS’s thermal performance   To overcome these limitations, engineers have used several strategies:   High-temperature alloys (polymer blends): Blending ABS with engineering plastics with higher Tgs can improve overall heat resistance. For example, ABS/PC alloys (ABS combined with polycarbonate) can be made into materials with higher HDTs than ABS alone. Such blends generally improve tensile strength and stiffness, as well as thermal stability. For this reason, ABS-PC filaments are popular in the 3D printing community. Reinforced composites: Adding inorganic fillers can significantly increase ABS’s HDT. Glass fibers are particularly effective—about 30% glass fiber filler can increase ABS’s heat distortion temperature (HDT) by about 40°C (e.g., from about 90°C to about 130°C) by forming a thermally stable network. Talc or mica fillers can slightly increase the heat distortion temperature (about 10-15°C) by forming a heat-insulating layer. These reinforcements also increase stiffness, but may reduce impact strength. Heat stabilizers: Additives such as hindered phenol antioxidants or organometallic stabilizers can slow down the thermal oxidation of ABS, extending its service life at high temperatures. Flame retardant additives (bromine-based or phosphorus-based) not only reduce flammability but also enhance thermal stability, thereby increasing the distortion temperature of ABS. Annealing and processing: Careful processing (such as annealing molded parts) can relieve internal stresses and improve heat distortion performance. Optimizing mold design and curing conditions can also help parts withstand higher service temperatures. Chemical modification: Arguably the most effective method is to modify the ABS polymer itself, either by copolymerization or grafting. Introducing rigid monomers into the ABS backbone can significantly increase its Tg and heat distortion performance. This led us to develop Styrene-NPMI-MAH terpolymers, a class of heat-resistant ABS modifiers developed and produced by Yangchen Tech.   3. Styrene-NPMI-MAH copolymer: a high-performance ABS modifier   Styrene-NPMI-MAH copolymer (also known as NSM copolymer) is a random terpolymer of styrene, N-phenylmaleimide (NPMI), and maleic anhydride (MAH). Its high heat resistance comes from its aromatic rigid NPMI units and polar MAH groups. YangchenTech's copolymers can be formulated to have glass transition temperatures well above 150°C.     N-Phenylmaleimide Manufactured by YANGCHEN TECH Weicome Inquiry! Specification     Property Limits Results Appearance Yellow powder Yellow powder Purity % >98 99.5 Melting Range ℃ >85 88~90   NPMI-styrene-MAH copolymer (about 47% NPMI content in the composition) has a glass transition temperature (Tg) of about 190°C. When mixed with ABS, the effect is significant: Vicat softening point, tensile strength, and flexural strength all increase with increasing addition of NSM copolymer.   Any technical support,pls contact us!      

Polyimide resin Powder manufactured by Yangchen Tech plays a critical role in advanced friction materials by serving as the high-performance binder or matrix that holds together reinforcing fibers and fillers. Its outstanding thermal stability, wear resistance, and ability to maintain a stable coefficient of friction under changing loads and temperatures make it an ideal replacement for conventional phenolic systems in demanding applications.     High-Temperature Resistance & Thermal StabilityFriction interfaces—such as brake pads and clutch plates—can reach temperatures above 300 °C during heavy or repeated braking. Polyimide resin maintains mechanical integrity and frictional properties at these temperatures, preventing “fade” (loss of braking performance) and extending service life.  Abrasion & Wear ResistanceThe inherently high hardness and chemical resistance of polyimide help reduce material loss under sliding contact. Composites formulated with polyimide binders show lower wear rates compared to phenolic-based friction materials, translating to longer intervals between replacements.  Stable Coefficient of FrictionPolyimide-based composites exhibit minimal variation in friction coefficient across a wide temperature range, ensuring predictable braking or clutch engagement without judder, chatter, or noise. Modifications—such as adding graphite or ceramic fillers—can further tune friction levels for specific applications.  Applications Automotive & Heavy-Duty Brakes: Pads and linings for performance vehicles, trucks, and off-road equipment that demand high fade resistance. Aerospace Brake Systems: Carbon-carbon or carbon-ceramic discs often use polyimide matrix composites for landing-gear and wheel brakes, where weight savings and thermal endurance are paramount. Industrial Machinery: Clutches and brakes in stamping presses, mining equipment, and wind-power generators benefit from the resin’s durability under high loads. Grinding Wheels & Cutting Tools: As a binder for superabrasive (diamond, CBN) wheels, polyimide delivers improved wheel life and cutting consistency at elevated operating temperatures. Processing & FabricationTypical manufacturing methods include hot molding, cold/hot isostatic pressing, and even advanced techniques like injection molding or 3D printing of pre-ceramic precursors. These processes allow precise control of resin/filler ratios and part geometry.    When you need friction materials that can withstand extreme heat, deliver consistent braking performance, and offer superior wear life, polyimide resin — often filled with fibers (e.g., aramid, carbon) and solid lubricants (e.g., graphite, MoS₂) — is the binder of choice for next-generation brake pads, clutch facings, industrial brakes, and superabrasive tools.

Phenylmethane bismaleimide BMI-200 (Other name:BMI-2300) ,CAS 67784-74-1) manufactured by Yangchen Tech is a high-performance thermoset resin for demanding aerospace, electronics, adhesives and composite applications. It is an aromatic bismaleimide (BMI) resin known for its excellent thermal stability, mechanical strength and chemical resistance. BMI-200 is typically supplied as a tan crystalline powder and cures to form a hard glassy network with a very high glass transition temperature (typically >250°C) and very low volatile by-products.   Physical Properties Appearance and physical properties: tan crystalline powder (softening point ≈83°C; melting point ≈150-160°C). Density ≈1.22g/cm³. Very low volatile matter content (<1%). Thermal properties: Glass transition temperature ~287°C (DMA); maintains integrity above 250°C. 5% weight loss at around 408°C indicates excellent heat resistance. BMI-2300 cures by addition (Michael/ene reaction) with no volatile byproducts. Mechanical properties: High flexural strength (about 204MPa at room temperature) and stiffness (flexural modulus about 4.4GPa at room temperature). Barcol hardness about 59. High modulus and strength are maintained at elevated temperatures. Electrical properties: Dielectric constant ≈ 3.1, loss tangent ≈ 0.012 (GHz frequency), making it ideal for high-speed/high-frequency electronic devices. High insulation resistance and low dielectric loss. Chemical properties: Acid value about 2.4mgKOH/g. Excellent resistance to solvents, fuels, and moisture. Insoluble in non-polar solvents (e.g. toluene), but soluble in highly polar aprotic solvents (THF, DMF, MEK).   Technical Indicators   Appearance Softening point Acid value Solubility Brownish-yellow lumps 60-120℃ ＜10 50% transparent solution (ketone solvent)   Solubility   Solvent ACETONE MEK THF DMF NMP TOLUENE Phenylmethane bismaleimide 50-80 60-80 20-100 ＜80 ＜50 Insoluble     Benefits of Phenylmethane bismaleimide  BMI-200   Exceptional Thermal Stability: Maintains structural integrity well above 250°C (glass transition ~287°C). Minimizes discoloration and degradation in high-temperature service. Ideal for jet-engine components, turbine parts and high-speed electronic devices. High Mechanical Performance: High modulus and strength even at elevated temperatures. Improves stiffness and fatigue life of composite parts. Resists deformation under load, enhancing reliability of structural laminates and housings. Chemical & Environmental Resistance: Aromatic imide backbone provides excellent resistance to fuels, solvents, acids and moisture. Enables long-term stability in aviation fuels, hydraulic fluids, and corrosive environments. Low moisture uptake improves dimension stability in humid conditions. Electrical & Dielectric Advantages: Low dielectric constant/loss makes BMI-2300 ideal for RF/microwave circuit boards and high-voltage insulation. Ensures signal integrity and insulation strength in harsh environments. High Tg also raises the operating temperature of laminates, improving thermal cycling reliability. Manufacturing Reliability: Cures via addition chemistry without evolving gases, so parts have minimal voiding or blistering. Improves bond adhesion (e.g. to copper foil in PCBs) and composite consolidation. Reduces processing defects compared to condensation thermosets. Lightweight, Flame-Resistant: Enables weight reduction in aerospace/electronics versus metal alternatives while providing inherent flame retardancy (aromatic structures are self-extinguishing). Helps OEMs meet stringent FAR/FMVSS fire, smoke and toxicity requirements.     

N,N'-(4,4'-diphenylmethane)bismaleimide is an aromatic bismaleimide resin known for its excellent high temperature resistance and mechanical properties. It is a high melting point yellow powder with strong chemical resistance.In the electronics field, BMI resins manufactured by Yangchen tech is used to make heat-resistant laminates and electrical insulation materials for harsh conditions (H/F grades). In contrast, traditional epoxy resins are widely used in PCB laminates and adhesives due to their low cost and ease of use, but they begin to lose strength and degrade at high temperatures. This blog compares the material properties and application differences of 4,4′-bismaleimide (BMI) and epoxy resins in electronic devices. N,N'-(4,4'-diphenylmethane)bismaleimide Whatever you needs, Yangchen Tech is at your side. Warehouse of Yangchen Tech Whatever you needs, Yangchen Tech is at your side. Warehouse of Yangchen Tech Whatever you needs, Yangchen Tech is at your side.   The rigid, highly conjugated structure of N,N'-(4,4'-diphenylmethane) bismaleimide gives it a high melting point (about 150-160°C) and glass transition temperature. It is almost insoluble in water/ethanol, but soluble in polar organic solvents such as acetone or DMF. High curing temperatures (usually 200-250°C) make BMI crosslinked into a dense three-dimensional network structure with excellent thermal stability.Commercial systems usually mix BMI with vinyl or allyl comonomers (e.g. DABA, vinyl phenol) to improve toughness. Cured BMI is still harder and stronger than most epoxies at high temperatures.   Technical Indicators   Appearance Melting point Acid value Volatile Specification Gel time 200℃ Toluene Solubility Yellow powder 150-160℃ ≤1mgKOH/g ≤1% ＞98% ＜300 S Totally soluble or a small amount of insoluble matter, transparent solution   The significant advantage of 4,4′-bismaleimide (BMI) resins is thermal stability. Unlike standard epoxy resins, which soften and lose modulus above about 120-150°C, BMI-based networks maintain mechanical integrity at temperatures well above 200°C. BMIs maintain strength and stiffness in high temperature environments (e.g., aerospace engines, gas turbines) where epoxies tend to fail. In fact, high-Tg BMI laminates or prepregs maintain excellent mechanical properties up to about 250°C. In contrast, most epoxy-based electronic materials have a Tg below 150°C, limiting them to low-grade insulation applications. BMI also has excellent mechanical strength and stiffness. Its rigid aromatic backbone gives it high tensile and flexural strength. Compared to epoxies, BMI composites can withstand greater static and dynamic loads without deformation. For example, parts made with a 4,4′-BMI matrix, such as aircraft fuselage panels or connector housings, will exhibit higher compression and impact resistance than equivalent epoxy-based parts. In tests, BMI composites have demonstrated improved durability under heavy loads and high-velocity impacts, thereby extending the service life and improving the safety of high-performance equipment. While epoxies are tough at room temperature, they tend to become brittle or creep at elevated temperatures, while the network rigidity of BMI remains strong. Another key advantage is its chemical and environmental resistance. BMI resins are more resistant to corrosion from solvents, acids, and other chemicals than typical epoxy formulations.   Property 4,4′-BMI (Bismaleimide Resin) Epoxy Resin Glass Transition (Tg) >200 °C (often ~250 °C); stable mechanical/dielectric at high temps ~100–150 °C; mechanical properties degrade above ~120 °C High-Temp Strength Retains strength up to ~250 °C Softens and may creep/fail well below 200 °C Mechanical Modulus Stiffer at all temperatures (especially when toughened) Less stiff overall; can be toughened but weakens at high temp Density Lightweight vs. metal; potentially lighter than epoxy formulations Lightweight vs. metal; but slightly denser than BMI in some cases Thermal Conductivity Poor conductor; can be filled for thermal applications Poor conductor; also fillable with ceramics or carbon Electrical Insulation Meets Class F/H (155–180 °C); suitable for motors, coils, high-temp circuits Often limited to Class B (130 °C); may not meet high-temp specs Flame Rating Inherently flame-retardant; low smoke/toxicity, fewer additives needed Needs more additives for flame retardancy