Phenylmethane bismaleimide BMI-200 (Other name:BMI-2300) ,CAS 67784-74-1) manufactured by Yangchen Tech is a high-performance thermoset resin for demanding aerospace, electronics, adhesives and composite applications. It is an aromatic bismaleimide (BMI) resin known for its excellent thermal stability, mechanical strength and chemical resistance. BMI-200 is typically supplied as a tan crystalline powder and cures to form a hard glassy network with a very high glass transition temperature (typically >250°C) and very low volatile by-products.   Physical Properties Appearance and physical properties: tan crystalline powder (softening point ≈83°C; melting point ≈150-160°C). Density ≈1.22g/cm³. Very low volatile matter content (<1%). Thermal properties: Glass transition temperature ~287°C (DMA); maintains integrity above 250°C. 5% weight loss at around 408°C indicates excellent heat resistance. BMI-2300 cures by addition (Michael/ene reaction) with no volatile byproducts. Mechanical properties: High flexural strength (about 204MPa at room temperature) and stiffness (flexural modulus about 4.4GPa at room temperature). Barcol hardness about 59. High modulus and strength are maintained at elevated temperatures. Electrical properties: Dielectric constant ≈ 3.1, loss tangent ≈ 0.012 (GHz frequency), making it ideal for high-speed/high-frequency electronic devices. High insulation resistance and low dielectric loss. Chemical properties: Acid value about 2.4mgKOH/g. Excellent resistance to solvents, fuels, and moisture. Insoluble in non-polar solvents (e.g. toluene), but soluble in highly polar aprotic solvents (THF, DMF, MEK).   Technical Indicators   Appearance Softening point Acid value Solubility Brownish-yellow lumps 60-120℃ ＜10 50% transparent solution (ketone solvent)   Solubility   Solvent ACETONE MEK THF DMF NMP TOLUENE Phenylmethane bismaleimide 50-80 60-80 20-100 ＜80 ＜50 Insoluble     Benefits of Phenylmethane bismaleimide  BMI-200   Exceptional Thermal Stability: Maintains structural integrity well above 250°C (glass transition ~287°C). Minimizes discoloration and degradation in high-temperature service. Ideal for jet-engine components, turbine parts and high-speed electronic devices. High Mechanical Performance: High modulus and strength even at elevated temperatures. Improves stiffness and fatigue life of composite parts. Resists deformation under load, enhancing reliability of structural laminates and housings. Chemical & Environmental Resistance: Aromatic imide backbone provides excellent resistance to fuels, solvents, acids and moisture. Enables long-term stability in aviation fuels, hydraulic fluids, and corrosive environments. Low moisture uptake improves dimension stability in humid conditions. Electrical & Dielectric Advantages: Low dielectric constant/loss makes BMI-2300 ideal for RF/microwave circuit boards and high-voltage insulation. Ensures signal integrity and insulation strength in harsh environments. High Tg also raises the operating temperature of laminates, improving thermal cycling reliability. Manufacturing Reliability: Cures via addition chemistry without evolving gases, so parts have minimal voiding or blistering. Improves bond adhesion (e.g. to copper foil in PCBs) and composite consolidation. Reduces processing defects compared to condensation thermosets. Lightweight, Flame-Resistant: Enables weight reduction in aerospace/electronics versus metal alternatives while providing inherent flame retardancy (aromatic structures are self-extinguishing). Helps OEMs meet stringent FAR/FMVSS fire, smoke and toxicity requirements.