Polyimides (PIs) are high-temperature engineering polymers originally developed by the DuPont™ Company. PIs exhibit an exceptional combination of thermal stability (>500°C), mechanical toughness, and chemical resistance. They have excellent dielectric properties and inherently low coefficient of thermal expansion. They are formed from diamines or diisocyanates and dianhydrides such as those shown in the picture.
There is more than one type of polyimide. Today we are going to talk about the polyimide resin and polyimide film. The chart below just shows the comparisons.
Polyimide film could be made from polyimide resin. The resin is first dissolved in a solvent and then cast onto a substrate. The solvent is then evaporated, leaving behind a thin film of polyimide. The film is then annealed, which helps to improve its properties.
The connection between polyimide film and polyimide resin is that they are both made from the same basic materials. The difference is that the film is a thin, flexible sheet, while the resin is a more viscous liquid.
Polyimide film and polyimide resin have many of the same properties. They are both heat-resistant, strong, and chemically resistant. They are also both transparent to a wide range of wavelengths.
However, there are some differences between the two materials. Polyimide film is more flexible than polyimide resin. This is because the film is made from a thinner layer of material. Polyimide resin is also more viscous than polyimide film. This means that it is more difficult to work with.
Polyimide film and polyimide resin are both valuable materials with a wide range of applications. They are used in a variety of industries, including electronics, aerospace, and medical devices.
Reference: https://www.sciencedirect.com/topics/materials-science/polyimide